4 results about "Surface roughening" patented technology

The invention discloses a high-reflecting, heat-insulating and heat-preservation concrete gas-filled brick. The concrete gas-filled brick is characterized in that calcium carbide and sodium rosinate are used as composite air-entraining agents, a layer of a polyester coats the surface so that polyester-coated calcium carbide is obtained, hollow glass beads are subjected to cleaning oil removal, surface roughening and coupling to form surface-coupled glass beads, titanium dioxide and cerium oxide are deposited on the surfaces of the hollow glass beads through a hydrothermal method so that the modified hollow glass beads are obtained, the raw materials are mixed, the mixture is heated through steam to form a casting material, the casting material is poured into a mold, and the model is subjected to maintenance at the constant temperature and constant humidity, blank repair and steam maintenance at a high temperature so that the high-reflecting, heat-insulating and heat-preservation concrete gas-filled brick is obtained. A preparation method of the concrete gas-filled brick has simple processes and realizes a low cost. The concrete gas-filled brick has good strength, low thermal conductivity and good anti-cracking effects, saves energy, is environmentally friendly and satisfies the needs of the construction project and the requirements of environmental protection.

The invention discloses a wafer-level packaging method of a semiconductor device and belongs to the technical field of semiconductor packaging. The method comprises the steps that a silicon wafer is taken; arraying of an insulation layer, a conducting electrode, a silicon through hole, a re-wiring metal layer and the like is completed on the silicon wafer through a wafer-level silicon substrate adapter plate, and an inversion zone is reserved for an LED chip; the LED chip is arranged inversely to the inversion zone; a light transmission layer covering the LED chip is formed, and the surface of the light transmission layer is subjected to roughening; and the silicon wafer obtained after packaging is cut into packaging bodies of single semiconductor devices. According to the wafer-level packaging method of the packaging structure of the semiconductor device, the wafer-level silicon substrate adapter plate technology and the surface roughening technology are used for forming the packaging structure of chips with the same size, size is small, a heat resistance value is low, cost is low, and brightness is high.

The invention discloses a treatment machine for increasing surface roughness of plastic foam particles. The treatment machine is mainly characterized in that a driving shaft of an electric device is fixedly connected with a flying bar in a material bin inner cavity; at least two sets of sawtooth-shaped blades are distributed and connected on a frame of the flying bar in the axial direction; the edges of blade teeth of the opposite sawtooth-shaped blades of on the flying bar are annularly sleeved with a sleeve with sieve holes distributed in the outer circle with the distance a=2 mm to 6 mm, and the sleeve is connected with a material bin; a feeding hole is formed in the other end of the material bin and corresponds to a feeding end opening of the flying bar. Under the action of outside suction force in the work process, the blade teeth on the sawtooth-shaped blades on the flying bar rotate, the surfaces of the plastic foam particles adsorbed on the surface of an inner cavity of the sleeve are scratched and pulled, roughness is increased, and then the plastic foam particles are sucked into the material bin through the sieve holes in the surface of the inner cavity of the sleeve through extrusion to be discharged out. The plastic foam particles with the rough surfaces are in mixed and coated connection through cement and pulverized fuel ash, the adhesive force is high, mixtures are evenly stirred, the material of a forming die shell is even and dense, connecting strength is high, and machining quality of die shell production is improved.