Solar cell and method of manufacture thereof, and solar cell module

[0136]A heterojunction solar cell of Example 1 was manufactured in the following manner.

[0137]An n-type single-crystal silicon wafer having a light incident surface direction identical to the (100) surface and having a thickness of 200 μm was provided as a single-crystal silicon substrate of a first conductivity type. The silicon wafer was immersed in a 2 wt % aqueous HF solution for 3 minutes to remove silicon oxide covering on the surface, and thereafter rinsed twice with ultrapure water. The silicon substrate was immersed in a 5 / 15 wt % aqueous KOH / isopropyl alcohol solution held at 70° C. for 15 minutes, and the surface of the wafer was etched to form a textured surface. Thereafter, the wafer was rinsed twice with ultrapure water. The surface of the wafer was observed using an atomic force microscope (AFM manufactured by Pacific Nanotechnology, Inc.), and it was confirmed that the surface of the wafer was mostly etched, and a pyramidal texture surface exposed at the (111) plane ...

[0147]A heterojunction solar cell was prepared in the same manner as in Example 1 except that the ratio of a metallic material powder to a silver powder in the printing paste for forming the first electroconductive layer 71 was changed as shown in Table 1.

[0148]A heterojunction solar cell was prepared in the same manner as in Example 1 except that the thickness of the insulating layer 9 was changed as shown in Table 1.