The invention discloses a
wafer transmission control method, which comprises the steps: inputting target gas into a process cavity, and carrying out vacuum exhaust, so that the process cavity is maintained at a first pressure; sequentially opening the gate valves of the process chamber and a transition chamber, and conveying a
wafer from the transition chamber at a second pressure to a supportingneedle
assembly rising in the process chamber at the first pressure, wherein the second pressure is larger than the first pressure, and the difference value of the second pressure and the first pressure is within a preset range; closing the gate valves of the transition chamber and the process chamber in sequence, and stopping inputting the target gas into the process chamber; keeping vacuum exhaust for a preset duration to reduce the concentration of the target gas in the process chamber; and controlling the supporting needle
assembly to drive the
wafer to descend so as to place the wafer onan electrostatic chuck located below the supporting needle
assembly. According to the method, wafer sliding caused by
air cushion effect can be weakened or eliminated, so that the problem of AWC datadiscretization after
nitrogen pressure control is solved.