Method for eliminating resin film and method for producing laminate

[0112] (Production of reinforcing plate)

[0113] The glass plate of the reinforcing plate uses a glass plate (manufactured by Asahi Glass Co., Ltd., AN100, alkali-free glass) of length 720 mm × width 600 mm × thickness 0.4 mm obtained by the float method. The average linear expansion coefficient of the glass plate is 38×10 -7 / ℃.

[0114] The glass plate was cleaned with pure water and UV cleaned to clean the surface of the glass plate. Then, 100 parts by mass of solvent-free addition reaction type silicone (manufactured by Shinetsu Silicone Co., Ltd., KNS-320A) and 5 parts by mass of platinum-based catalyst (Shinetsu Silicone Co.) were coated on the surface of the glass plate with a spin coater. ,Ltd., CAT-PL-56) mixture (coating amount 20g / m 2 ).

[0115] The solvent-free addition reaction type silicone includes a linear organoalkenyl polysiloxane (main agent) having a vinyl group and a methyl group bonded to a silicon atom, and a hydrogen atom and a methyl group bonded to the

[0130] In Example 2, a linear polyorganosiloxane having vinyl groups at both ends (manufactured by Arakawa Chemical Industry Co., Ltd., 8500) and a methylhydrogenpolysiloxane having a hydrosilyl group in the molecule ( The mixture of Arakawa Chemical Industry Co., Ltd. 12031) and a platinum-based catalyst (Arakawa Chemical Industry Co., Ltd., CAT12070) was used as a curable resin composition for forming the resin layer. Reinforcing was prepared in the same manner as in Example 1, except that board.

[0131] Here, the mixing ratio of the linear polyorganosiloxane and the methylhydrogenpolysiloxane is adjusted so that the molar ratio of the vinyl group and the hydrosilyl group is 1:1. In addition, the amount of the platinum-based catalyst was 5 parts by mass relative to 100 parts by mass in total of the linear polyorganosiloxane and methylhydrogenpolysiloxane.

[0132] Then, in the same manner as in Example 1, the figure 2 After heat-processing the laminated body shown, the peeling op

[0137] In Example 3, the same as in Example 2 was produced as figure 2 After heat-processing the laminated body shown, the peeling operation of the glass substrate and the reinforcing plate is performed.

[0138] After the peeling operation, by heating the reinforcing plate in the atmosphere at 370°C for 5 minutes, the surface of the resin layer (resin film) opposite to the glass plate was exposed to the atmosphere at 370°C for 5 minutes. After that, the reinforcing plate was cooled from 370°C to 50°C at an average cooling rate of 15°C / sec, and then cooled to room temperature. Next, brush cleaning with isoparaffin solution (manufactured by Idemitsu Kosan Co., Ltd., IP SOLVENT 2028, solubility parameter of 7, flash point of 86°C) for 1 minute, and after washing off the resin layer (resin film), heating by blowing Air to 200°C to remove the solvent.

[0139] The isoparaffin solution described above contains 80.5% by mass of isohexadecane, 3.0% by mass of isotridecane, and 16.5% by m