Fluorescent powder applying device for LED chip packaging

[0017] The present invention requires the closed LED structure to be conventionally arranged, and the LED chip 1 is installed on the substrate 2, and the circuit layer 3 is also arranged on the substrate 2 at the same time, and the negative part on the circuit layer 3 is connected to the negative electrode of the LED chip 1.

[0018] The overall structure of the coating device is as follows figure 1 As shown in , the main body of the coating device includes a phosphor powder tank 4, the top of the phosphor powder tank 4 is provided with an agitator 12; The top plate 6 is connected with each other, openings 7 are opened on the side plate 5 and the top plate 6, and a slide cover 8 is sleeved on the outside of the side plate 5 and the top plate 6, and the side and top surfaces of the slide cover 8 are provided with outlets 13 , a sealing plug 11 is also provided under the top of the sliding cover 8, and the position of the sealing plug 11 corresponds to the opening position on th...

[0021] Such as figure 1 As shown, as an improvement to the above-mentioned device, in another embodiment, a heat insulating layer 10 is provided on the outside of the heating component 9 . The heat insulating layer 10 can prevent the silica gel in the phosphor powder tank 4 from being heated and cured.

[0023] Such as figure 1 As shown, a spring 16 is also provided on the pressing rod 15 , and a limit card 17 is also provided above the spring 16 , and the limit card 17 is fixed on the inner wall of the pipe body 14 . Due to the action of the spring 16, it can be ensured that after the coating device is lifted, the openings 7 on the side plate 5 and the top plate 6 are quickly closed to prevent waste of silica gel and fluorescent powder.