6 results about "Led packaging" patented technology

The invention discloses a side light-emitting deep ultraviolet LED packaging bracket and a production process thereof, the production process includes forming aluminum nitride slurry, injecting it into a base layer mold to form an aluminum nitride base layer; forming a metal layer on the surface of the aluminum nitride base layer; arranging a metal electrode block in a preset electrode region on the metal layer; covering layer of aluminum nitride paste on the metal layer to form an aluminum nitride substrate embryo body; The aluminum nitride substrate embryo is sintered and annealed at high temperature to form an aluminum nitride ceramic structure; The aluminum nitride ceramic structure is laser drilled in each die bonding region on the first surface on the side of the second enclosure damto form a hole from the first surface to the metal layer, and the hole is filled with a metal material; A circuit is formed by photolithography on the first surface according to a preset circuit, anda plurality of independent aluminum nitride ceramic supports are formed after cutting. By the invention, the deep ultraviolet LED lateral light emission can be realized.

The invention discloses an LED packaging structure and packaging method thereof. The LED packaging structure comprises a square bracket, wherein an LED chip is arranged at the center of the bowl cup of the bracket; the electrodes of the LED chip are connected with the positive and negative electrodes of the bracket by golden lines; a step is arranged on the bowl cup wall of the bracket; glue filling holes are formed in the four corner of the step; each glue filling hole is communicated to the bottom of the bowl cup; a glass sheet is arranged on the step; one surface of the glass sheet is coated with fluorescent powder; the surface, coated with the fluorescent powder, of the glass sheet faces downwards. The LED packaging structure and the packaging method thereof can be used for not only solving a problem of a yellow ring of white light of an LED, but also solving a problem of luminance decay of the white light of the LED; silica gel is injected into the bowl cup of the bracket by the glue filling holes, the operation is convenient, and the fluorescent powder can not be concentrated near to the LED chip or the bottom of the bowl cup of the bracket, and therefore, the luminance decay of the LED chip, caused by long-time heating, is avoided, and from another point of view, the service life of the LED is prolonged.

The invention discloses a nano lanthanum oxide modified talcum powder enhanced polyphenylene sulfide-based heat dissipating material for LED. After the composite material is modified by nano lanthanum oxide at high temperature, talcum powder is used as toughening and reinforcing packing, stearic acid is mixed to the surface of the talcum powder, the modified composite packing and polyphenylene sulfide are compatible well, agglomeration of small-grain-size particles is improved effectively, the small-grain-size particles can be uniformly dispersed in macromolecules, stable and efficient modification effect is achieved, processing property and mechanical property of the polyphenylene sulfide are improved effectively, added nano copper and carbon nano tube composite heat conduction packing are adsorbed and combined to master batches well, heat conduction property of the composite material is improved effectively, strength and plasticity of the material are improved, and the composite material with good mechanical property and good heat conduction property is prepared and has wide application space in the aspect of LED packaging.

The invention discloses a packaging method and an LED packaging structure, the packaging method is used for preparing the LED packaging structure, the method comprises the steps that solid fluorescentglue is prepared, the solid fluorescent glue comprises an annular fluorescent glue layer, and an accommodating cavity is defined by the fluorescent glue layer; the solid fluorescent glue is placed ona packaging base, and first liquid fluorescent glue is injected into the containing cavity; fixing an LED chip in the cavity in the LED bracket with the cavity; the LED support is inverted, so that the cavity faces the solid fluorescent glue, and the LED support is buckled on the solid fluorescent glue, so that the LED chip is soaked in the liquid fluorescent glue; and after the first liquid fluorescent glue is cured, the packaging base is removed to obtain the LED packaging structure. According to the packaging method of the LED packaging structure provided by the invention, the glue amountin the LED bracket can be effectively controlled.

The invention provides a multi-cavity plant illumination LED packaging structure. The structure comprises a plurality of luminescence units used for emitting different wavelength light, a metal support which supports and is electrically connected to each luminescence unit and a plurality of cups and bowls accommodating the luminescence units respectively. Each cup and bowl are arranged on the metal support. Each luminescence unit comprises at least one LED chip installed in the corresponding cup and bowl, a gold thread which makes two poles of the LED chip electrically connected to the metal support respectively and a packaging glue which is filled in the cup and bowl. In the invention, through arranging the plurality of luminescence units used for emitting the different wavelength light, each luminescence unit is installed on the metal support, and the plurality of cups and bowls are arranged on the metal support so as to accommodate each luminescence unit so that the plurality of luminescence units are integrated into one packaging structure and a size is small. The LED chip of each luminescence unit is electrically connected to the metal support so that the metal support can control each luminescence unit, which is convenient for integratedly arranging a control circuit, and cost is low.