Vacuum pressure adjusting device

A technology for regulating devices and vacuum pressure, applied in the direction of valve devices, electrical components, functional valve types, etc., can solve problems such as inability to realize internal and external pressure differences, complex structure and control methods, and uneven gas diffusion speed increase, to achieve increased The effect of practicality

Pending Publication Date: 2020-07-10
艾华(无锡)半导体科技有限公司
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Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a vacuum air pressure regulating device, which has the advantages that the internal and external pressure difference does not fluctuate with the chamber pressure and can be adjusted and accurately controlled by replacing the cover plate, which solves the problem of the existing air pressure The adjustment device is provided with two limited communication pipes, and the two limited communication pipes are opened and closed by the control valve. The function of the control valve i

Method used

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Embodiment Construction

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] see Figure 1-3 , a vacuum pressure regulating device, comprising an outer chamber 6, an inner chamber 3 is arranged inside the outer chamber 6, and the inner chamber 3 is fixedly connected with the outer chamber 6, and a limited communication pipe is arranged at the bottom end of the inner chamber 3 2. The limited communication pipe 2 is fixedly connected to the inner chamber 3. The material of the limited communication pipe 2 is steel, preferably stainle

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Abstract

The invention relates to the technical field of semiconductor manufacturing, and discloses a vacuum pressure adjusting device. The vacuum pressure adjusting device includes an outer cavity, an inner cavity is formed in the outer cavity, the inner cavity is fixedly connected with the outer cavity, limited communicating pipes are arranged at the bottom end of the inner cavity, and the limited communicating pipes are fixedly connected with the inner cavity. According to the vacuum pressure adjusting device, the limited communicating pipes which are of a tubular structure with bottom are directlyconnected with the inner cavity, the bottom parts are hollow, and the hollow parts are connected with an outer cavity; a cover plate is a circular thin plate, the cover can cover the hollow parts of the limited communicating pipes, and can move up and down freely; the falling cover plate covers the hollow parts of the limited communicating pipes, the inner cavity and the outer cavity are isolated(or minor leakage may exist ), and the state of the cover plate is related to the pressure difference between the inner cavity and the outer cavity, the hollow area of the limited communicating pipesand the weight of the cover plate; and when the pressure difference is large, the cover plate is pushed to rise, and when the pressure difference is small, the cover plate falls down, so that the internal and external pressure difference is kept constant without changing with the cavity pressure.

Description

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Claims

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Application Information

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Owner 艾华(无锡)半导体科技有限公司
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