Light emitting device

[0046]As shown in FIGS. 1 to 3, the light emitting device 1 of the present embodiment includes an LED chip 10, a mounting substrate 20 to which the LED chip 10 is mounted, an encapsulation member 50 which is elastic and formed of an encapsulation resin material to encapsulate the LED chip 10 and bonding wires 14 connected to the LED chip 10, a lens 60 formed of a transparent resin material, a dome-shaped color conversion member 70 mounted on the mounting substrate 20 to cover a light output surface 60b of the lens 60. The color conversion member 70 is molded from a transparent material and a fluorescent material which is excited by a light from the LED chip 10 to emit a light of a color different from a luminescent color of the LED chip 10. The lens 60 has a recess 40 facing a surface of the mounting substrate 20, and is fixed on the mounting substrate 20 such that the encapsulation member 50 is set into the recess 40. The color conversion member 70 is arranged to cover the lens 60 ...

[0075]The light emitting device 1 of this embodiment shown in FIG. 10 is almost consistent in fundamental component with that of first embodiment. Like components are designated by like reference numerals, and no duplicate explanation deemed necessary.

[0076]In this embodiment, the inner diameter of the circular-shaped opening 26a formed in a center part of the resist layer 26 is set slightly smaller than the maximum of inner diameter of the color conversion member 70, the color conversion member 70 is mounted on the mounting substrate 20 with its entire circumference joined to the periphery of circular-shaped opening 26a by an adhesive agent 75.

[0077]The manufacturing method of the light emitting device 1 in this embodiment includes the following steps. Firstly, the LED chip 10 is mounted to the mounting substrate 20, and the LED chip 10 is connected to the mounting substrate 20 by means of the bonding wires 14, as shown in FIG. 11, and then the LED chip 10 and the bonding wires 14 ...

[0079]The light emitting device 1 of this embodiment shown in FIG. 10 is almost consistent in fundamental component with that of first embodiment. Like parts are designated by like reference numerals, and no duplicate explanation deemed necessary.

[0080]In this embodiment, the lens 60 is provided with an injection port 41 for injecting the encapsulating resin material into the recess 40, and a discharge port 42 for discharging a residue of said encapsulating resin material.

[0081]The manufacturing method of the light emitting device 1 in this embodiment includes the following steps. At first, LED chip 10 is mounted to the mounting substrate 20 and connected to mounting substrate 20 with bonding wires 14. Then, the lens 60 is adhered to the mounting substrate 20 to dispose the LED chip 10 and bonding wires 14 within the recess 40 of the lens (step (a)). Secondly, the recess 40 of the lens is filled with the uncured encapsulation resin material through the injection port 41 of the lens ...