How to Linear expansion coefficient?

Q: How to Linear expansion coefficient?

Light emitting device,Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same,Novel polymide film and use thereof,Touch assembly and vehicle

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4 results about "Linear expansion coefficient" patented technology

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Light emitting device

InactiveUS20090095967A1High outputImprove reliabilitySolid-state devicesSemiconductor/solid-state device manufacturingEffect lightEngineering

The lighting device (1) includes an LED chip (10), a mounting substrate (20) mounting thereto the LED chip, an encapsulation member (50) made of an encapsulating resin material for encapsulation of the LED chip, and a lens (60) made of a transparent resin material. The lens (60) is provided in its bottom with a recess (40) and is secured to the mounting substrate (20) with the encapsulation member (50) disposed within the recess (40). The encapsulation member (50) is confined within the recess of the lens of the transparent resin material, which minimizes a difference in the coefficient of linear expansion between the encapsulation member and the surroundings for restraining occurrence of voids in the encapsulation member at a low temperature.

Owner:PANASONIC CORP

Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same

ActiveUS20140004321A1High transparencyLow coefficient of linear expansionDuplicating/marking methodsDecorative surface effectsEpoxyPolymer science

Provided are a resin composition which offers both high transparency and a low linear expansion coefficient and can be used as a material for a dry film, and also a dry film obtained from this composition, an optical waveguide, and a photoelectric composite wiring board. The resin composition for an optical waveguide includes: (A) an epoxy resin constituted by a solid epoxy resin with one or less hydroxyl group in a molecule, and a liquid epoxy resin with one or less hydroxyl group in a molecule; (B) a curing agent with one or less hydroxyl group in a molecule; and (C) a nanosize silica sol, and contains no compound including two or more hydroxyl groups in a molecule as a resin component.

Resin composition for optical waveguide, dry film, optical waveguide, and photoelectric composite wiring board using same

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Owner:PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

Novel polymide film and use thereof

ActiveCN1933959ASynthetic resin layered productsCoatingsOptoelectronicsMetal

It is an object to provide a polyimide film that has little dimensional change in the step of laminating metal on the polyimide film and the step of etching the metal to form a circuit, and can stabilize the rate of dimensional change over the entire width. It is a continuously produced polyimide film. When measuring the linear expansion coefficient a in the direction of the molecular orientation axis and the linear expansion coefficient b in the direction perpendicular to the molecular orientation axis at 100°C to 200°C over the entire width of the film, a and b A polyimide film satisfying a specific relationship, or when the tear propagation resistance value c in the direction of the molecular orientation axis and the tear propagation resistance value d in the direction perpendicular to the molecular orientation axis are measured for the entire width of the film, c and d A polyimide film satisfying a specific relationship can solve the above-mentioned problems.

Owner:KANEKA CORP

Touch assembly and vehicle

PendingCN109669561AAvoid damageSimple designElectric/fluid circuitInput/output processes for data processingTemperature differenceTouchscreen

The invention provides a touch assembly and a vehicle applying the same. The touch assembly comprises a touch screen, wherein, when the ambient temperature T where the touch screen is located is changed from the normal temperature T1 to the limit temperature T2, the touch screen has a deformation amount delta L in the length direction of the touch screen; a mounting part which is provided with a mounting groove, wherein the touch screen is arranged in the mounting groove, a preset distance d is reserved between the touch screen and the mounting groove in the length direction of the touch screen, and the preset distance d meets the condition that 2d is larger than or equal to delta L. According to the touch assembly provided by the invention, the system classification is carried out according to the linear expansion coefficients of different touch assembly parts and different materials, the expansion coefficients of part materials are referred during design, a touch screen is preventedfrom being damaged by temperature difference expansion and shrinkage, and the improved design of the system is realized.