10 results about "Unit structure" patented technology

A micro-electromechanical dimensioned bimorph structure includes a first element layer structure, and a second element layer structure. The element layer structures are provided in various combinations, including piezoelectric/piezoelectric, antiferroelectric/antiferroelectric or antiferroelectric/piezoelectric. The layer thickness of the element structure is less than 100 μm. A bonding layer bonds the first element structure directly to the second element structure and the bonding layer thickness is less than 10 μm. The bimorph structure can be made in various forms including a cantilever or a diaphragm. Microfluidic devices using the bimorph structures may also be constructed.

The invention belongs to the field of construction design, and relates to a method for assembling a temporary small building spliced by paper universal components, namely assembling a building by inserting paper universal components having three different plane modes, bendable bearing paper wall bodies and paper door and windows into a spliced system structure which is attached to the surfaces of structural top and bottom plates and spliced by four same unit structures. The bendable bearing wall bodies are inserted into strip grooves in the periphery and inner side of the splicing system structure to form an outer wall and a partition wall; the paper universal components having different heights and types are inserted into the grooves in the structural bottom plate of the splicing system structure to form a table top, a bed surface and floor; the bendable bearing paper wall body can slide inside the strip grooves and can form a new house type by combining adjustment of the paper universal components. Various living functions including sleeping, cooking, working, dining, washing and the like can be integrated in the spaces. The method is quick, simple and convenient, and the operation can be implemented without specialized persons.

The present disclosure provides an apparatus for producing fine particles, the apparatus comprising: a particle formation mechanism and a particle-outlet micro-channel. The particle formation mechanism may include a unit-structure, wherein the unit-structure includes: first and second portions adjacent to each other; a first inlet defined in the first portion at a first height, wherein a continuous phase solution is injected into the first inlet; a second inlet defined in the first portion at a second height different from the second height, wherein a dispersed phase solution is injected into the second inlet; a merging volume defined in the second portion adjacent to the first portion, wherein the merging volume is defined at third height, wherein the third height is equal to either the first height and the second height, or has a value between the first height and the second height, wherein the continuous phase solution and the dispersed phase solution are merged in the merging volume, wherein fine particles are formed via the merging between the continuous phase solution and the dispersed phase solution in the merging volume; and a first micro-channel and a second micro-channel branching from the merging volume so as to be in communication with the first inlet and the second inlet, respectively.

The invention discloses a method for grinding a cylindrical array structure with a high-order curve section by an arc array grinding wheel. The grinding wheel is trimmed into an arc array structure with repeated k-order sections, and an array cylindrical surface is ground through the arc array grinding wheel in a variable tangential point reciprocating manner according to the curve tangency principle; and the movement path of the grinding wheel in the high-order curve section plane of the cylindrical surface is an equidistant parallel line at the distance of r from a high-order curve. After the tangential point of the grinding wheel is changed once in the high-order curve section plane, the grinding wheel does reciprocating motion in the direction perpendicular to the high-order curve section plane for one time, so that the grinding of one generating line of the cylindrical surface is finished. Since the grinding wheel is of an array structure, the grinding process of all high-order curve section cylindrical arrays can be finished as long as the grinding of one cylindrical structure unit in the array structure is finished. After the section unit structure of the grinding wheel is trimmed into an arc, the tangential points between the grinding wheel and workpieces are ensured to form the high-order curve through the interpolation motion of a machine tool; and the array structureis ground in a variable tangential point manner, and the grinding accuracy is high.