Radio frequency device

The invention provides a radio frequency device, which comprises a frame and a plastic package material coated outside the frame; a chip and a conductive pad are arranged on the frame, the chip is electrically connected with the conductive pad through an inner lead, the chip and the inner lead are coated by the plastic package material, and the conductive pad is exposed out of the outer surface ofthe plastic package material and used for being welded with a circuit board. Compared with the prior art, the radio frequency device adopts a flat package formed by coating the frame with the plasticpackage material, is small in size, thin in thickness and light in weight, is suitable for an electronic product with a narrow installation space, has very low impedance and self-inductance, and canmeet the application in the field of microwave or communication; meanwhile, the solid structure formed by coating the frame with the plastic package material can significantly improve the strength ofthe radio frequency device, reduce the brittleness of the radio frequency device and make the radio frequency device not easy to damage. Moreover, the radio frequency device adopts a pin-free design,and is directly welded with the circuit board by using the conductive pad, so that the requirement on the size of the circuit board is reduced, and the radio frequency device can be applied to the circuit board with a smaller size.