Epoxy modified low-dielectric fluorine-containing polyphenyl ether coating and high-frequency high-speed copper-clad plate prepared from same

A technology of epoxy modification and polyphenylene ether, which is applied in lamination, layered products, lamination devices, etc., can solve the problem of dielectric constant reduction, achieve low dielectric constant, improve flame retardancy, and reduce shrinkage rate effect

Active Publication Date: 2020-07-03
SHUNDE POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above-mentioned solutions can reduce the dielectric constant to a certain extent, but the dielectric constant needs to

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Embodiment one

[0035] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:

[0036] The structural formula of the low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin is as follows, and its preparation method is, in solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol , 2,6-difluorophenol and catalyst A, reacted at a temperature of 20°C for 2 hours, then added 2,6-dimethyl-1,4-benzenediol and reacted for 3 hours, and the low molecular weight end could be obtained by precipitation method Hydroxyl fluorinated polyphenylene ether resin; solvent B, 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-bis The weight ratio of methyl-1,4-benzenediol is: 100:50:200:10:1:10;

[0037]

[0038] Wherein, in the structural formula, x is 5, y is 20, z is 2, and n is 20.

[0039] The solvent B is ethyl acetate, and the catalyst A is a complexing agent

Example Embodiment

[0052] Embodiment two

[0053] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:

[0054] The structural formula of the low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin is as follows, and its preparation method is: in solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol , 2,6-difluorophenol and catalyst A, react at a temperature of 20°C for 10 hours, then add 2,6-dimethyl-1,4-benzenediol and react for 8 hours, and the low molecular weight end can be obtained by precipitation method Hydroxyl fluorinated polyphenylene ether resin; solvent B, 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-bis The weight ratio of methyl-1,4-benzenediol is: 100:60:300:20:3:20;

[0055]

[0056] Wherein, in the structural formula, x is 6, y is 23, z is 4, and n is 25.

[0057] The solvent B is tetrahydrofuran, and the catalyst A is copper chloride and N,N

Example Embodiment

[0070] Embodiment Three

[0071] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:

[0072] The structural formula of the low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin is as follows, and its preparation method is: in solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol , 2,6-difluorophenol and catalyst A, react at a temperature of 60°C for 6 hours, then add 2,6-dimethyl-1,4-benzenediol and react for 7 hours, and the low molecular weight end can be obtained by precipitation method Hydroxyl fluorinated polyphenylene ether resin; solvent B, 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-bis The weight ratio of methyl-1,4-benzenediol is: 100:70:800:20:8:40;

[0073]

[0074] Wherein, in the structural formula, x is 8, y is 25, z is 4, and n is 40.

[0075] The solvent B is dioxane, and the catalyst A is cuprous bromide and diethylami

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Abstract

The invention relates to an epoxy modified low-dielectric fluorine-containing polyphenyl ether coating and a high-frequency high-speed copper-clad plate prepared from the same. The epoxy modified low-dielectric fluorine-containing polyphenyl ether coating is characterized by comprising low-molecular-weight fluorine-containing polyphenyl ether structure epoxy resin, epoxy resin, a diluent, a curingagent, a toughening agent, an accelerant, a flame retardant, a silane coupling agent, a filler and a solvent A. The high-frequency high-speed copper-clad plate prepared from the epoxy modified low-dielectric fluorine-containing polyphenyl ether coating has the characteristics of low dielectric constant, high Tg, ultralow shrinkage rate, low water absorption rate and easiness in processing, and can be applied to the field of 5G circuit boards.

Description

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Claims

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Application Information

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Owner SHUNDE POLYTECHNIC
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