Epoxy modified low-dielectric fluorine-containing polyphenyl ether coating and high-frequency high-speed copper-clad plate prepared from same
A technology of epoxy modification and polyphenylene ether, which is applied in lamination, layered products, lamination devices, etc., can solve the problem of dielectric constant reduction, achieve low dielectric constant, improve flame retardancy, and reduce shrinkage rate effect
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Example Embodiment
[0034] Embodiment one
[0035] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:
[0036] The structural formula of the low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin is as follows, and its preparation method is, in solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol , 2,6-difluorophenol and catalyst A, reacted at a temperature of 20°C for 2 hours, then added 2,6-dimethyl-1,4-benzenediol and reacted for 3 hours, and the low molecular weight end could be obtained by precipitation method Hydroxyl fluorinated polyphenylene ether resin; solvent B, 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-bis The weight ratio of methyl-1,4-benzenediol is: 100:50:200:10:1:10;
[0037]
[0038] Wherein, in the structural formula, x is 5, y is 20, z is 2, and n is 20.
[0039] The solvent B is ethyl acetate, and the catalyst A is a complexing agent
Example Embodiment
[0052] Embodiment two
[0053] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:
[0054] The structural formula of the low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin is as follows, and its preparation method is: in solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol , 2,6-difluorophenol and catalyst A, react at a temperature of 20°C for 10 hours, then add 2,6-dimethyl-1,4-benzenediol and react for 8 hours, and the low molecular weight end can be obtained by precipitation method Hydroxyl fluorinated polyphenylene ether resin; solvent B, 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-bis The weight ratio of methyl-1,4-benzenediol is: 100:60:300:20:3:20;
[0055]
[0056] Wherein, in the structural formula, x is 6, y is 23, z is 4, and n is 25.
[0057] The solvent B is tetrahydrofuran, and the catalyst A is copper chloride and N,N
Example Embodiment
[0070] Embodiment Three
[0071] (1) Preparation of low-molecular-weight hydroxyl-terminated fluorinated polyphenylene ether resin:
[0072] The structural formula of the low-molecular-weight hydroxyl-terminated fluorine-containing polyphenylene ether resin is as follows, and its preparation method is: in solvent B, add 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol , 2,6-difluorophenol and catalyst A, react at a temperature of 60°C for 6 hours, then add 2,6-dimethyl-1,4-benzenediol and react for 7 hours, and the low molecular weight end can be obtained by precipitation method Hydroxyl fluorinated polyphenylene ether resin; solvent B, 2,6-bis(trifluoromethyl)phenol, 2,6-dimethylphenol, 2,6-difluorophenol, catalyst A and 2,6-bis The weight ratio of methyl-1,4-benzenediol is: 100:70:800:20:8:40;
[0073]
[0074] Wherein, in the structural formula, x is 8, y is 25, z is 4, and n is 40.
[0075] The solvent B is dioxane, and the catalyst A is cuprous bromide and diethylami
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