Wafer clamp and cleaning method thereof

The invention discloses a wafer clamp and a cleaning method. The method comprises the following steps of firstly, nitric acid solution soaking, wherein the clamp is put into a soaking pool, and a nitric acid solution is poured for soaking; secondly, deionized water washing, wherein the nitric acid solution on the clamp soaked in the step S1 is washed with deionized water; thirdly, silver-chromiumstripping solution soaking, wherein the clamp washed in the step S2 is put into a new soaking pool, and a silver-chromium stripping solution is poured for soaking; fourthly, deionized water washing, wherein the silver-chromium stripping solution on the clamp soaked in the step S3 is washed away; fifthly, ultrasonic cleaning, wherein the clamp cleaned in the step S4 is put into an ultrasonic pool to be subjected to ultrasonic cleaning; sixthly, dehydration, wherein dehydration treatment is conducted on the clamp subjected to ultrasonic cleaning in the step S5 through absolute ethyl alcohol, andthe clamp is washed for 300 seconds; and seventhly, baking, wherein the clamp dehydrated in the step S6 is put into a baking oven of 80 +/-10 DEG C to be baked for 30-60 minutes to finish clamp cleaning.