Dually-curable resin composition, cured body prepared therefrom, and electronic device comprising such cured body

Active Publication Date: 2020-07-02
DOW SILICONES CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a dually curable resin that can be quickly cured and has excellent curability in shadow areas. The cured body has high hardness, adhesion, and releasability, making it ideal for use in electronic devices. The resin composition includes specific groups of materials, such as hydrocarbon, alkyl, cycloalkyl, alkenyl, aryl, arylalkyl, halogenated alkyl, and other substituents. The resulting composition can be quickly cured and has excellent performance in electronic devices.

Problems solved by technology

However, the room temperature curable silicone composition has a disadvantage in that it takes a long time until curing completely.
And in case of general room temperature curable silicone composition, there has been a problem that the cured body is broken or it is caused cohesive failure when the silicone cured body is removed from the substrate, because it has good adhesion to the substrate.
However, the photo curable silicone composition has excellent curability in a surface area directly contacting with UV-Vis irradiation, but has poor curability in a shadow area, and in particular, there is a problem that material in such area, which is not UV-Vis irradiated, is not cured.

Method used

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  • Dually-curable resin composition, cured body prepared therefrom, and electronic device comprising such cured body
  • Dually-curable resin composition, cured body prepared therefrom, and electronic device comprising such cured body
  • Dually-curable resin composition, cured body prepared therefrom, and electronic device comprising such cured body

Examples

Experimental program
Comparison scheme
Effect test

synthesis example 1

t Polyorganosiloxane (A-1)

[0109]100 parts by weight of a hydroxy-terminated polydimethylsiloxane (PDMS) and 5 to 10 parts by weight of vinyltrimethoxy silane were added with 0.03 to 0.1 pats by weight of acetic acid to a 500 ml three-necked flask, and the mixture was mixed with a stirrer and then the temperature was then raised to a temperature of about 150° C. to about 160° C. with stirring. After 3 hours, the reaction mixture was vacuum-cleaved to remove the residual catalyst and vinyltrimethoxysilane.

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Abstract

A dually curable resin composition is provided. The composition comprises: (A) a first polyorganosiloxane comprising at least one alkenyl group and at least one alkoxy group in one molecule; (B) a second polyorganosiloxane comprising at least two photoreactive functional groups in one molecule on its side chain of siloxane backbone; (C) at least one silane compound represented by a particular chemical formula herein or its partially hydrolyzed compound; (D) at least one photoinitiator; and (E) at least one condensation reaction catalyst. A cured body prepared by curing the dually curable resin composition, and an electronic device comprising the cured body, are also provided.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application claims priority to and all advantages of Korean Patent Application No. 10-2017-0097097, filed on 31 Jul. 2017, the content of which is incorporated herein by reference.TECHNICAL FIELD[0002]Dually-curable resin composition, cured body prepared therefrom, and electronic device comprising the cured body are disclosed.BACKGROUND ART[0003]Silicone materials are widely used not only in the consumption market but also sealants, adhesives, coatings, and potting compounds, etc., in industry. Such materials include room temperature vulcanizing (RTV) silicone which can be cured by moisture in air at room temperature, high temperature vulcanizing (HTV) silicone, and photo (UV-Vis) curable silicone, etc.[0004]In general, a room temperature curable silicone material (or moisture curable silicone materials) is used as sealants and adhesives in electro-electronic devices since no separate heating process is required for curing. Such a ro...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08G77/16C09J183/06H01L23/29
CPCC08G77/16C09J183/06C08L83/06C08L2205/025H01L23/296C08G77/18C08G77/20C08G77/28C09J183/04C08L83/04C08K5/5419C08L83/00C08G77/08C08K5/5415C08K5/5397
Inventor LIM, JONG-OK
Owner DOW SILICONES CORP
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