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4 results about "Titanium nitride" patented technology

Titanium nitride (TiN; sometimes known as Tinite) is an extremely hard ceramic material, often used as a coating on titanium alloys, steel, carbide, and aluminium components to improve the substrate's surface properties.

Plastics products and preparation method thereof

InactiveCN101396890AImprove wear resistanceFeel goodVacuum evaporation coatingSynthetic resin layered productsCopper coatingCeramic coating
The invention relates to a plastic product, comprising plastic substrate. The plastic product is characterized in that the product also comprises a copper coating, a nickel coating, a chrome coating and a ceramic coating from the surface of the plastic substrate to the outside in sequence; the ceramic coating is one or more layer of titanium nitride, titanium carbide and titanium carbonitride. The plastic product made by the invention has excellent wearing resistance, the film formed on the surface of the plastic product has excellent adhesiveness, and the plastic product that is obtained finally also has ceramic texture and good handfeel.
Owner:BYD CO LTD

Method for making metallized capacitor

The invention discloses a method of making metallic capacitor comprising, providing a semi-conductor substrate with a copper studded arrangement, then forming a sheet metal on the copper studded arrangement, and forming a metallic capacitor on the sheet metal, which includes an electrode layer composed of tantalum nitride layer or titanium nitride, forming an insulation side wall layer on the side wall of the metal capacitor. íí
Owner:TAIWAN SEMICON MFG CO LTD

Method for preventing metal fuse from being excessively etched

The invention provides a method for preventing a metal fuse from being excessively etched. The method comprises the steps of providing a metal fuse, and depositing an interlayer film on the metal fuse; forming a top metal layer on the interlayer film, wherein titanium nitride layers are respectively arranged on an upper surface and a lower surface of the top metal layer; etching the top metal layer, and forming a bonding pad and a protection pattern arranged above the metal fuse; defining an etching window above the bonding pad and the protection pattern after a passivation layer is deposited;and etching according to the etching window to remove titanium nitride on an upper surface of the bonding pad, leftwards and rightwards opening the windows in the metal fuse to release a product generated by burnout of the metal fuse when a lower-layer fuse is protected by using the protection pattern as a mask. By the method, the metal fuse is protected, the windows are also formed in the metalfuse, the cost is reduced, meanwhile, the metal layer at a lower layer is protected, windows are formed in a left edge and a right edge of the metal fuse, and the product generated by burnout of the metal fuse is conveniently released and is prevented from being gathered in an original place to for short circuit.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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