Preparation process before silicon wafer cutting

The invention relates to a preparation process before silicon wafer cutting. The preparation process comprises the following steps that S1, the type of a scribing blade is determined according to thename of a product and the size of a scribe lane; S2, an operator is required to inspect an objective table before cutting, and if impurities exist on the objective table, the operator is required to blow off the impurities by using an air gun; S3, the interface of 'blade condition data' is clicked so as to read the exposure amount of a cutting edge; and S4, pure water detection is carried out, wherein the detection content comprises 1, the resistance value of pure water, and 2, the pH value of the pure water, and as for the frequency, the detection is carried out once every shift and carried out at work during the morning shift and evening shift. According to the preparation process before silicon wafer cutting, related equipment and wafers are detected in all directions before wafer cutting is carried out, so that the safety during cutting and the cutting accuracy are ensured, the waste occurrence rate is reduced, and the production cost of enterprises is reduced.