Advanced plastic flexible electronic component 3D printing integrated circuit technology

[0045] This embodiment mainly introduces a method for 3D printing integrated circuits of advanced plastic flexible electronic components; please refer to the process flow figure 1 , figure 1 The invention provides a flow chart of an advanced plastic flexible electronic component 3D printing integrated circuit process.

[0046] An advanced plastic flexible electronic component 3D printing integrated circuit process, which includes the following steps:

[0047] Step S1, selecting advanced plastics as the base;

[0048] Step S2, laser mask projection processing the substrate to form deep grooves;

[0049] Step S3, backfilling the metal paste;

[0050] Step S4, sintering the metal paste to form.

[0051] Further, in the step S2, the width of the deep groove is 5-20 microns; the depth of the deep groove is 75-85 microns.

[0052] Further, in the step S2, the inner surface of the deep groove is an uneven plane structure.

[0053] Further, the advanced plastic material includes on

[0062] This embodiment mainly introduces an optimal method for the 3D printing integrated circuit process of advanced plastic flexible electronic components.

[0063] An advanced plastic flexible electronic component 3D printing integrated circuit process, which includes the following steps:

[0064] Step S1, selecting advanced plastics as the base;

[0065] Step S2, laser mask projection processing the substrate to form deep grooves;

[0066] Step S3, backfilling the metal paste;

[0067] Step S4, sintering the metal paste to form.

[0068] Further, in the step S2, the width of the deep groove is 12.5 microns; the depth of the deep groove is 80 microns.

[0069] Further, in the step S2, the inner surface of the deep groove is an uneven plane structure.

[0070] Further, the advanced plastic material includes one or two combinations of polyimide or polyethersulfone resin.

[0071] Further, in the step S1, the thickness of the substrate is 100 microns.

[0072] Further, the

[0075] Based on the above Embodiment 1, this embodiment mainly introduces a method for backfilling metal paste in the 3D printing integrated circuit process of advanced plastic flexible electronic components. For the specific method, please refer to figure 2 , which includes the following steps:

[0076] Step S31, install the front and rear squeegee strips of the 3D printer to ensure that the squeegee is flat, and then install the squeegee bracket;

[0077] Step S32, adjusting the speed and pressure of the 3D printer;

[0078] Step S33 , using a 3D printer to print the metal paste on the pattern substrate for backfilling.

[0079] Further, the front and rear squeegee strips of the 3D printer are squeegee strips with a hardness of 100-150.

[0080] Further, before step S31, the uniform metal paste needs to be rotated.

[0081] Further, the oblique opening of the squeegee is 500 microns;

[0082] Further, the height of metal paste backfill is the same as that of advanced plast