3 results about "Bisphenol F" patented technology

The invention relates to a high-bonding-strength conductive adhesive for repairable microelectronic assembly and a preparation method thereof. The high-bonding-strength conductive adhesive comprises the following raw materials in percentage by weight: resin, conductive filler, a curing agent, an active diluent and an additive, wherein the resin is prepared from the following raw materials in percentage by weight: bisphenol A epoxy resin and bisphenol F epoxy resin; the conductive filler is prepared from the following raw materials in percentage by weight: flake silver powder and spherical silver powder; the curing agent is prepared from the following raw materials in percentage by weight: 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, polyether amine 400 and triethanolamine; the reactive diluent is prepared from the following raw materials in percentage by weight: polyethylene glycol diglycidyl ether and polypropylene glycol diglycidyl ether; and the additive is a substance capable of achieving a thickening effect. The problems that an existing conductive adhesive is poor in conductivity, poor in bonding strength, incapable of being detached and repaired after bonding and the like are solved. The adhesive is widely applied to bonding materials for circuit connection of electronic components.

The invention provides a low-voltage heating carbon fiber cloth/graphene composite material. The low-voltage heating carbon fiber cloth/graphene composite material comprises an ethylene propylene diene monomer layer A, a graphene coating, carbon fiber cloth and an ethylene propylene diene monomer layer B which are in contact in sequence, the graphene coating is prepared from graphene slurry, and the graphene slurry is prepared from the following components in percentage by weight: 5 to 8 percent of graphene, 0.5 to 1 percent of CWF-6028 antioxidant, 10 to 15 percent of bisphenol F type epoxy resin and 10 to 15 percent of epoxy curing agent. The ethylene propylene diene monomer is selected as a carrier, so that the electricity utilization safety of the composite material in the use process can be protected. According to the graphene slurry coating modified carbon fiber cloth disclosed by the invention, the electrical conductivity and thermal conductivity of the carbon fiber cloth are improved, the electrical resistivity is smaller, and a large amount of heat can be generated under the action of low voltage of 36V. The invention also provides a preparation method of the low-voltage heating carbon fiber cloth/graphene composite material.