Process flow control method and semi-conductor equipment

一种工艺流程、控制方法的技术,应用在半导体制备领域,能够解决无法正常实施、冲突工艺流程等问题

Inactive Publication Date: 2018-04-27
SHANGHAI HUALI MICROELECTRONICS CORP
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In semiconductor manufacturing, a set of process flow is often set in advance, which includes multiple process segments, that is, process steps, such as photolithography, etching (wet etching, dry etching), diffusion, ion implantation, etc. Etc., each process section represents the execution of the corresponding process for semiconductor devices. The process section includes mandatory process sections and optional process sections. The mandatory process section is an indispensable item in the execution of the entire process process, while the optional process section It is an item that can be selected according to the actual process. The existing method of adding an optional process section in the process flow is to insert an open point between the required process sections, and insert the optional process section that needs to be added at the position of the open point , but this method of operation will have the following defects. The inserted optional process segment cannot have the authority to set the working status like the required process segment, and after the optional process segment is inserted to establish the process flow, there will often be process segment parameters Conflicts with the parameters of the required process section cause the established process flow to fail to be implemented normally

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0029] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0030] The technical solution of the invention includes a method for controlling the process flow.

[0031] An ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides a process flow control method and semi-conductor equipment and is applied to the semi-conductor equipment to control the process flow. A process flow chain is formed through allrequired process sections and all optional process sections according to the sequence of the process flow, and specifically the following steps are included, corresponding work attributes for each optional process section in the process flow chain are defined; the work attributes for each optional process section in the process flow chain are determined; an execution process flow chain representing process steps required to performed in the process flow are formed according to the work attributes of each required process section and of each optional process section. The method is advantaged in that disadvantages that the process flow can not be performed because of parameter faults caused by insertion of the optional process sections and the inserted optional process sections cannot havethe permission to set the work status like the required process sections existing in the prior art are solved.

Description

technical field [0001] The invention relates to the field of semiconductor preparation, in particular to a process flow control method and semiconductor equipment. Background technique [0002] In semiconductor manufacturing, a set of process flow is often set in advance, which includes multiple process segments, that is, process steps, such as photolithography, etching (wet etching, dry etching), diffusion, ion implantation, etc. Etc., each process section represents the execution of the corresponding process for semiconductor devices. The process section includes mandatory process sections and optional process sections. The mandatory process section is an indispensable item in the execution of the entire process process, while the optional process section It is an item that can be selected according to the actual process. The existing method of adding an optional process section in the process flow is to insert an open point between the required process sections, and inser...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q10/06G06Q50/04
CPCG06Q10/0633G06Q50/04Y02P90/30
Inventor 徐莹周维林聪
Owner SHANGHAI HUALI MICROELECTRONICS CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products