Thermally conductive silicone grease composition

a technology of silicone grease and composition, which is applied in the direction of lubricant composition, heat exchange elements, chemistry apparatus and processes, etc., can solve the problems of reducing performance, affecting and uneven thermal conduction, so as to suppress the effect of elongation and small hardness ris

Active Publication Date: 2015-01-01
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The inventor's new type of silicon grease has very low hardness but it doesn't lose its flexibility after being heated up too much for some time. This makes it easier to work with while still maintaining good thermal conduction properties.

Problems solved by technology

This patent describes different ways to improve the efficiency of removing heat from electronic components without causing any issues like air being trapped between them due to imperfections in the design of the component itself. Existing solutions involve adding an insulating layer on top of the heat generating part, but this can lead to reduced thermal conductance and reduce the effectiveness of the heat dissipation process. Therefore, there is a technical solution proposed where a special type of material called heat dissipating grease is added to create strong bonds between the semiconductor chip and the heat spreader.

Method used

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  • Thermally conductive silicone grease composition
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  • Thermally conductive silicone grease composition

Examples

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examples

[0046]Examples and Comparative Examples are shown to particularly illustrate the present invention, which should not be construed as limited to the following Examples. Tests on the effects related to the present invention were carried out in the following ways.

[Viscosity]

[0047]The absolute viscosity of grease composition was measured by means of the Malcom viscometer (Type PC-1T) at 25° C.

[Thermal Conductivity]

[0048]The respective compositions were poured into a 3 cm thick mold and covered with a kitchen wrap, followed by measurement with a device of Model QTM-500, made by Kyoto Electronic Manufacturing Co., Ltd.

[Elongation at Breakage]

[0049]The respective compositions were thermally vulcanized at 150° C. for 90 minutes to provide a 2 mm thick sheet, followed by measurement after shaping the sheet into No. 2 dumbbell, described in JIS K6251. Separately, a sample cured in the form of a sheet was aged at 150° C. for 1,000 hours and its elongation after the aging was measured by a similar

examples 1 to 11

, Comparative Examples 1 to 7

[0074]The compositions of Examples 1 to 11 and Comparative Examples 1 to 7 were obtained by mixing the components (A) to (G) in the following way.

[0075]More particularly, component (A) was placed in a 5 liter planetary mixer (made by Inoue Manufacturing Co., Ltd.), to which components (B) and (C) were added in such amounts as indicated in Tables 2 and 3, followed by mixing at 150° C. for one hour. The resulting mixtures were each cooled down to a normal temperature, to which components (D), (E), (F) and (G) were added in amounts indicated in Tables 2 and 3 and mixed to uniformity.

TABLE 2FormulationExample(parts by weight)1234567891011ComponentA-1100100100100100100100100100(A)A-2100A-3100A-4A-5ComponentB-150504050505051708090(B)B-250ComponentC-19659658509659659659651001117012801280(C)ComponentD-11.95.55.0(D)D-20.660.550.420.80.70.660.660.660.66D-32.31.911.472.82.32.12.32.32.32.3D-4D-5Si—H / Si-Vi2.42.02.22.02.12.22.02.42.42.42.4(number ratio)ComponentE-10.13

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Abstract

The present invention provides a thermally conductive grease composition which scarcely increases in hardness during high-temperature heating and has a minimized reduction in growth, containing:
    • (A) an organopolysiloxane including at least two alkenyl groups per molecule, the 25° C. kinetic viscosity being 5,000 to 100,000 mm2/s;
    • (B) a hydrolysable methyl polysiloxane, trifunctional at one terminus, represented by general formula (1)
(R1 is a C1-6 alkyl group, and a is an integer 5 to 100);
    • (C) a thermally conductive filler having a thermal conductivity of 10 W/m·° C. or greater;
    • (D) an organohydrogenpolysiloxane containing two to five hydrogen atoms directly bonded to a silicon atom (Si—H group) per molecule;
    • (E) an adhesion promoter having a triazine ring and at least one alkenyl group per molecule; and
    • (F) a catalyst selected from the group consisting of platinum and platinum compounds.

Description

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Claims

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Application Information

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Owner SHIN ETSU CHEM IND CO LTD
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