Method for improving distribution uniformity of LED (Light Emitting Diode) encapsulated fluorescent powder

[0029] Embodiment 1 Traditional LED packaging method

[0030] Such as figure 1 , the current basic process of COB packaging is: a, solid crystal, the chip 5 is fixed on the light source substrate 2, wherein the circuit layer and reflective layer are arranged on the substrate as usual, and the chip is fixed on the reflective layer; b, wire bonding, according to Design requirements, use gold wires to connect the circuits between the chips, the circuit connection mode is series or parallel or mixed connection, and connect the chip circuit with the positive and negative electrodes of the printed circuit layer on the substrate; c. Coating phosphor, soldering Place the qualified light source semi-finished product on the glue dispensing fixture 1, and then apply fluorescent glue on the glue coating area 4; d, bake and cure, put the light source semi-finished product coated with fluorescent glue into the oven to bake; During the process, due to the intrinsic absorption of the ligh...

[0032] Embodiment 2 LED packaging method provided by the present invention

[0033] In order to overcome the above-mentioned technical problems, the present invention provides a method for improving LED light source packaging, which includes the following steps: a. Die bonding, fixing the chip 5 on the light source substrate 2, wherein the substrate 2 is conventionally provided with a circuit layer and a reflective layer , the chip 5 is fixed on the reflective layer; b, wire bonding, according to the design requirements, connect the circuit between the chips 5 with a gold wire, the circuit connection mode is series or parallel or mixed connection, and the chip circuit and the printed circuit on the substrate The positive pole 3 of the layer is connected to the negative pole 6 of the printed circuit layer; c, short-circuit the positive and negative poles, the short-circuit probe 8 is set on the positive pole 3 of the printed circuit layer and the negative pole 6 of the printed...

[0038] Embodiment 3 LED packaging method provided by the present invention

[0039] The difference from Example 1 is that: the substrate is made of aluminum substrate; the phosphor is made of Mitsubishi BG201 silicate powder; the encapsulation glue is made of epoxy resin; the baking temperature is 60°C; the baking time is 5 minutes.