Quasi-synchronization packaging device and control method

一种控制方法、准同步的技术，应用在半导体/固态器件制造、电气元件、电固体器件等方向，能够解决灵活性差、光路复杂、不能及时调整等问题，达到实现实时调整、降低的时间、提升精确性的效果

Active Publication Date: 2016-11-23
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

All three packaging technology solutions can achieve laser glass packaging, but they all have their own disadvantages: due to the slow moving speed of the laser beam and the long heating time of the circumferential scanning packaging, non-uniform thermal stress is caused, which affects the packaging quality; synchronous packaging lacks flexibility, Moreover, the optical path is complex and the cost is high; the laser utilization rate of mask-assisted packaging is low, and the flexibility is poor and the cost is high
However, the open-loop control has the following disadvantages: time accuracy is difficult to maintain and power control is asynchronous control; no error in time calculation is allowed; when the laser beam moves beyond the error range, it cannot be adjusted in time; poor adaptability

Method used

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Embodiment Construction

[0028] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0029] Aiming at the problems existing in the prior art, the present invention adopts a fast position feedback mechanism, so that the laser power controller can adjust the power of the laser in real time or increase the speed of the spot at the corner according to the position of the beam. Using this method, while quickly adjusting the laser power, error correction can be performed on the beam position, so that the laser beam irradiation path remains within a controllable error range.

[0030] figure 1 It is a structural schematic diagram of the laser glass encapsulation system involved in the present invention. Such as figure 1 As shown, the laser glass packaging system includes a PC 0, a galvanometer detection and controller 1, a laser power controller 2, a pyrometer 3, a profiler 4, a laser 5, a galvanometer system 6 and a body 10 to be p...

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PUM

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Abstract

The invention discloses a quasi-synchronization packaging device. The quasi-synchronization packaging device comprises a laser power controller used for controlling a laser device for providing laser beams with different powers, a vibrating mirror unit comprising an X-Y-direction vibration mirror and an angle measurement sensor, and a vibration mirror detection control unit, wherein the laser beam is reflected through the X-Y-direction vibration mirror onto a to-be-packaged object surface to form a packaging spot, the angle measurement sensor is used for measuring a deflection angle of the X-Y-direction vibration mirror, and the vibration mirror detection control unit is connected with the X-Y-direction vibration mirror and the laser power controller. According to the quasi-synchronization packaging device, the laser power controller is controlled according to the deflection angle of the X-Y-direction vibration mirror.

Description

technical field [0001] The invention relates to the field of integrated circuit equipment manufacturing, in particular to a quasi-synchronous packaging device and control method. Background technique [0002] In modern society, more and more optoelectronic semiconductor devices are used in various fields, such as lighting, industrial production, scientific experiments, etc. Among them, OLED technology is widely used recently. Compared with traditional TFT technology, it has less power consumption, High definition, high resolution and other advantages; but OLED is sensitive to water vapor and oxygen, both of which can easily cause OLED device oxidation, demoulding, etc., resulting in premature aging or even damage to the device. In order to ensure effective and reliable operation of the OLED device, it is necessary to hermetically encapsulate the OLED. [0003] There are many technologies for encapsulation. The most popular at this stage is laser glass encapsulation, which i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L51/56
Inventor 聂仕华陈明谢仁飚赵娟
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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