Resin composition for sealing electronic devices, and electronic device

Active Publication Date: 2017-11-16
FURUKAWA ELECTRIC CO LTD
View PDF1 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is related to a composition for sealing electronic devices. The composition contains a crosslinkable organometallic desiccant that helps to form a sealing resin with high crosslink density and high water vapor barrier properties. The sealed electronic devices have improved sealing performance and durability, with reduced shear adhesive strength degradation due to humidification. The technical effect of this invention is to provide better protection and reliability for electronic devices.

Problems solved by technology

The organic light-emitting diode element (hereinafter, also referred to as OLED element) has a problem with a gradual deterioration of the emission property, such as emission brightness and emission efficiency caused by the use thereof.
Therefore, water vapor barrier property of these sealants is far from satisfactory.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition for sealing electronic devices, and electronic device
  • Resin composition for sealing electronic devices, and electronic device
  • Resin composition for sealing electronic devices, and electronic device

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0140]As a (meth)acrylate resin, 9.8 g of TEAl-1000 (trade name, manufactured by Nippon Soda Co., Ltd., polybutadiene-terminated urethane di(meth)acrylate resin), as a crosslinkable organometallic desiccant, 0.1 g of Al(HEA)3, as a polymerization initiator, 0.1 g of Esacure TZT (trade name, a mixture of 2,4,6-trimethylbenzophenone and 4-methylbenzophenone, polymerization initiator, manufactured by DKSH Japan K.K.), and as a polymerization inhibitor, 0.01 g of 2,6-di-t-butyl-p-cresol (manufactured by Tokyo Chemical Industry Co., Ltd.) were placed, and the resultant mixture was stirred at room temperature (25° C.) for 1 hour, to obtain a sealing resin composition in Example 1.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
Percent by massaaaaaaaaaa
Fractionaaaaaaaaaa
Fractionaaaaaaaaaa
Login to view more

Abstract

An electronic-device-sealing resin composition and an organic EL element, having, as a crosslinkable organometallic desiccant, a metal complex compound having crosslinkable alkoxide represented by formula (1) as a ligand:M(ORx)n  Formula (1)wherein, in formula (1), M designates Al, B, Ti or Zr; Rx in the ligand designates an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by formula (a); at least one of Rx's has a crosslinkable group; and n designates a valence of M.wherein, in formula (a), O* designates O of ORx in formula (1); R1 designates an alkyl group, an alkenyl group or an acyl group; R2 designates a hydrogen atom or an alkyl group; and R3 designates an alkyl group or an alkoxy group.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is a Continuation of PCT International Application No. PCT / JP2015 / 086528 filed on Dec. 28, 2015, which claims priority under 35 U.S.C. §119 (a) to Japanese Patent Application No. 2015-017222 filed in Japan on Jan. 30, 2015. Each of the above applications is hereby expressly incorporated by reference, in its entirety, into the present application.TECHNICAL FIELD[0002]The present invention relates to a resin composition for sealing electronic devices which contains a crosslinkable organometallic desiccant composed of a ligand having a crosslinkable group, and an electronic device sealed with this sealing resin composition. In particular, the present invention relates to bond or seal of an organic electronic device, an organic light-emitting diode element, a touch panel, a light-emitting diode (LED), and a solar cell.BACKGROUND ART[0003]The organic light-emitting diode element (hereinafter, also referred to as OLED element) ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L51/52H01L23/29B01D53/28C09K3/10B01J20/22H05B33/04H01L23/31
CPCH01L51/524H05B33/04H01L23/29H01L23/31H01L51/5259C09K3/10B01J20/223B01D53/28B01D53/02B01D53/261B01D2253/20B01J20/264B01J20/267B01J2220/66H10K50/841H10K50/846
Inventor MIEDA, TETSUYAASANUMA, TAKUMIISHIZAKA, YASUSHISAITO, KEIJI
Owner FURUKAWA ELECTRIC CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap