Random Copolymer Compound, Terminal-Modified Polymer Compound, and Resin Composition Including Said Compounds

a terminal modification and polymer compound technology, applied in the direction of heat-activated film/foil adhesives, polyether adhesives, non-macromolecular adhesive additives, etc., can solve the problems that the resin composition including the phenoxy resin cannot be used for the recent electronic device application, low heat resistance, dielectric loss, etc., to achieve excellent flexibility, heat resistance, water resistance, and adhesiveness. , the effect of easy formation of the film

Pending Publication Date: 2021-12-23
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention is about making a resin composition using a special material called a random copolymer compound and a terminal-modified polymer compound. This composition can be easily made into a film by a casting method and can be cured to create a flexible and durable product. The cured product has good properties like flexibility, heat resistance, water resistance, dielectric characteristics, and adhesiveness. The invention uses a type of resin called polyphenylene ether resin, which has specific chemical properties. This resin can be easily obtained by modifying the chemical structure of another compound called bisphenol A. The resulting resin composition can be useful in various applications.

Problems solved by technology

However, the cured product of the resin composition including the phenoxy resin has excellent adhesiveness, but low heat resistance, and besides has a high dielectric constant and a high dielectric loss tangent (the dielectric constant is about 3.5 and the dielectric loss tangent is about 0.03 at 1 GHz of the frequency).
Therefore, the actuality is that the resin composition including the phenoxy resin cannot be used for the recent electronic device applications where accelerated signal response speed is needed.
However, there is problems that those resins have incredibly low compatibility with other resins and besides low adhesiveness.
However, only polyphenylene ether resin, rubber component, and like give poor adhesiveness, therefore, an epoxy resin has to be added.
Therefore, there is problems that the epoxy resin makes the dielectric characteristics worse as seen in the phenoxy resin.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1 (

Synthesis of Random Copolymer Compound 1 of Present Invention)

[0076]24 parts (0.0141 mol) of polyphenylene ether resin having phenolic hydroxy groups at both ends (SA-90, manufactured by SABIC, average molecular weight 1,700), 16 parts (0.0053 mol) of polybutadiene resin having alcoholic hydroxy groups at both ends (G-3000, manufactured by NIPPON SODA CO., LTD., average molecular weight 3,000), 50 parts of toluene and 0.2 parts of 4-methoxyphenol were added into a flask equipped with a thermometer, a cooling pipe and a stirrer, further stirred and dissolved. Then, 5 parts of triethylamine were added as a catalyst. The temperature of the solution obtained was raised to 105° C. 3.29 parts (0.0162 mol) of terephthalic acid dichloride dissolved in 30 parts of toluene were added dropwise to the solution over 10 minutes and the reaction was conducted at 105° C. for 2 hours. Then, triethylamine hydrochloride generated by the reaction was removed by filtration. By concentrating the filtrate...

example 2 (

Synthesis of Terminal-Modified Polymer Compound 1 of Present Invention)

[0077]24 parts (0.0141 mol) of polyphenylene ether resin having phenolic hydroxy groups at both ends (SA-90, manufactured by SABIC, average molecular weight 1,700), 16 parts (0.0053 mol) of polybutadiene resin having alcoholic hydroxy groups at both ends (G-3000, manufactured by NIPPON SODA CO., LTD., average molecular weight 3,000), 50 parts of toluene and 0.2 parts of 4-methoxyphenol were added into a flask equipped with a thermometer, a cooling pipe and a stirrer, further stirred and dissolved. Then 5 parts of triethylamine were added as a catalyst. The temperature of the solution obtained was raised to 105° C. 3.29 parts (0.0162 mol) of terephthalic acid dichloride dissolved in 30 parts of toluene were added dropwise to the solution over 10 minutes and the reaction was conducted at 105° C. for 2 hours. After the temperature of the system was decreased to 80° C., 0.678 parts (0.0064 mol) of methacrylic acid ch...

example 3 (

Synthesis of Terminal-Modified Polymer Compound 2 of Present Invention)

[0078]24 parts (0.0141 mol) of polyphenylene ether resin having phenolic hydroxy groups at both ends (SA-90, manufactured by SABIC, average molecular weight 1,700), 16 parts (0.0053 mol) of polybutadiene resin having alcoholic hydroxy groups at both ends (G-3000, manufactured by NIPPON SODA CO., LTD., average molecular weight 3,000), 50 parts of toluene, and 0.2 parts of 4-methoxyphenol were added into a flask equipped with a thermometer, a cooling pipe and a stirrer, further stirred and dissolved. Then 5 parts of triethylamine were added as a catalyst. The temperature of the solution was raised to 105° C. 3.29 parts (0.0162 mol) of terephthalic acid dichloride dissolved in 30 parts of toluene were added dropwise to the solution over 10 minutes and the reaction was performed at 105° C. for 2 hours. After the temperature of the system was decreased to 80° C., 1.005 parts (0.0064 mol) of 2-isocyanatoethyl methacryl...

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Abstract

A random copolymer compound of (A) a polyphenylene ether resin having phenolic hydroxy groups at both ends, (B) an aliphatic polymer having alcoholic hydroxy groups at both ends, and (C) an acid dichloride compound that is a binder is disclosed, wherein the number of mol a of the (A) polyphenylene ether resin, the number of mol b of the (B) aliphatic polymer, and the number of mol c of the (C) acid dichloride compound that is a binder satisfies the relationship (a+b)>c.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This application is the United States national phase of International Application No. PCT / JP2019 / 042972 filed Nov. 1, 2019, and claims priority to Japanese Patent Application No. 2018-211095 filed Nov. 9, 2018, the disclosures of which are hereby incorporated by reference in their entirety.BACKGROUND OF THE INVENTIONField of the Invention[0002]The present invention relates to a random copolymer compound, a terminal-modified polymer compound, and a resin composition including said compound which can be easily formed into a film by casting its solution on the substrate, and can provide the curing reaction with a radical initiator, and moreover the cured product is excellent in flexibility, heat resistance, water resistance, dielectric characteristic, and adhesiveness.Description of Related Art[0003]A phenoxy resin is a polymer compound having a very large molecular weight obtained by polymerizing a difunctional epoxy resin and a difunctiona...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08G81/02C08F236/06C08G65/38C08K5/095C08G85/00
CPCC08G81/025C08F236/06C08G65/38C08G2650/38C08G85/004C08G2170/00C08K5/095C09J157/00C08F299/02C09J11/06C08G63/00C09J7/35C08G65/485C09J171/12
Inventor AKATSUKA, YASUMASASHIRAI, KAZUTERU
Owner NIPPON KAYAKU CO LTD
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