Manufacturing method for gas barrier film, and electronic member or optical member provided with gas barrier film

[0132]On a cycloolefin copolymer film (manufactured by Polyplastics Co., Ltd., TOPAS 6017, thickness 100 μm, glass transition temperature 160° C., abbreviated as “COC” in Table 1.) as a substrate, coating containing A polymer compound solution (manufactured by Clariant Japan, AQUAMICA NL110-20) of perhydropolysilazane as a silicon-based polymer compound and xylene as a solvent so that the thickness after drying was 150 nm was applied to the obtained coating film. It was heated at 120° C. for 2 minutes to form a polymer compound layer.

[0133] It should be noted that when the cycloolefin copolymer film was immersed in xylene at 23° C. for 72 hours, the gel fraction of the cycloolefin copolymer film was 80%.

[0134] Next, argon (Ar) was plasma ion-implanted into the surface of the polymer compound layer under the following conditions by using a plasma ion implantation apparatus to fabricate a gas barrier film 1 in which a gas barrier layer was formed on a base material.

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[0146] In Example 1, except that the base material and the solvent shown in the following Table 1 were used as the base material and the solvent, it was carried out in the same manner as in Example 1, and Examples 2 to 2 in which a gas barrier layer was formed on the base material were produced. 5. Gas barrier films 2-5.

[0147] In addition, in Table 1, PC, PSF, and PVAC have the following meanings.

[0148] ・PC: Polycarbonate resin film (PUREACE, manufactured by Teijin Chemicals, thickness 100 μm, glass transition temperature 145°C)

[0149] ・PSF: polysulfone-based resin film (manufactured by BASF Corporation, ULTRASON S3010, thickness 55 μm, glass transition temperature 187°C)

[0150] • PVAC: polyvinyl acetal resin film (manufactured by Sekisui Chemical Industry Co., Ltd., SLEC KS-10, thickness 20 μm, glass transition temperature 110° C.).