Production method of a capacitor

a production method and capacitor technology, applied in the manufacture of electrolytic capacitors, electrolytic capacitors, thermoelectric devices, etc., can solve the problems of inability to successfully form semiconductor layers, inability to increase the impergnation ratio within a normal time, etc., to achieve good esr performance, good performance, and high capacitance

Active Publication Date: 2007-06-21
RESONAC CORP
View PDF8 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011] As a result of intensive investigations to solve those problems, the present inventors have found that such problems can be overcome by impregnating pores with a semiconductor layer-forming precursor before energization to render the concentration of semiconductor layer-forming precursor in pores higher than that of semiconductor layer-forming precursor in an electrolytic solution and in this state, by passing a current in the electrolytic solution. The present invention has been accomplished based on this finding.
[0078] The capacitor produced according to the present invention can be preferably used for circuits requiring a high-capacitance and low ESR capacitor, such as a central processing circuit and a power source circuit. These circuits can be used in various digital devices such as a personal computer, server, camera, game machine, DVD equipment, AV equipment and cellular phone, and electronic devices such as various power sources. The capacitor produced according to the present invention has high capacitance and good ESR performance and therefore, by using this capacitor, electronic circuits and electronic devices having good performances can be obtained.

Problems solved by technology

According to the methods of Japanese Patent Nos. 1,985,056 and 2,826,341, good ESR may be obtained, but a long time is necessary to form a semiconductor layer and the impregnation ratio cannot be increased within a normal time.
The method of Japanese Patent No. 2,826,341 is disadvantageous in that counter electrodes are necessary for simultaneously forming semiconductor layers on multiple electric conductors on an industrial scale and the semiconductor layer attaches also to the counter electrodes.
The method of Japanese Patent No. 1,988,457 is disadvantageous in that when applied to the case of simultaneously forming semiconductor layers on multiple electric conductors, in the case where the chemical polymerization layer is thin, the semiconductor layer must be rendered thick by energization, but due to energization from an external electrode, the semiconductor layer formed on the electric conductor surface layer assembly inhibits the semiconductor layer-forming precursor from diffusing into the pore inside of the electric conductor and some semiconductor layers cannot be successfully formed by energization, whereas in the case where the chemical polymerization layer is thick, the semiconductor layer tends to be easily formed by energization, but a good ESR value is not obtained because a thick chemical polymerization layer is formed.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0080] By using and shaping a tantalum powder having CV (product of capacitance and electrochemical voltage) of 140,000 μF·V / g together with a tantalum lead wire of 0.24 mmφ, a sintered bodies in a size of 4.5×1.0×1.5 mm were produced (sintering temperature: 1,300° C., sintering time: 20 minutes, density of sintered body: 6.2 g / cm3; the Ta lead wire was vertically embedded in the center part of the 1.0×1.5 mm face of the sintered body while being buried 4 mm inside the sintered body and protruding 10 mm outside).

[0081] On a separately prepared polyimide-made resin plate having a length of 250 mm, a width of 30 mm and a thickness of 2 mm (There are provided by printed wiring, on the front surface of the plate, a circuit connecting connection terminals for 32 electric conductors and respective anodes of current regulative diodes and reaching the power supply terminal in the left side of plate, and on the back surface, a circuit electrically connected only to the connection terminals ...

example 2

[0087] An oxide dielectric film layer comprising Nb2O5 was formed through electrochemical formation at 23 V by using a niobium sintered body (made of powder having CV of 250,000 μF·V / g, nitrided amount: 11,000 ppm, amount of oxygen due to natural oxidation on the surface: 81,000 ppm, sintering temperature: 1,280° C., sintering time: 30 minutes, density of the sintered body: 3.4 g / cm3) and a niobium lead wire in place of the tantalum sintered body and the tantalum lead wire in Example 1. Then, a series of operations, that is, the sintered bodies were dipped in an alcohol solution of 2% ethylenedioxythiophene, pulled up, left standing, dipped in an alcohol solution of 18% iron naphthalenesulfonate, pulled up, left standing at 40° C. for 30 minutes and dipped in alcohol, were repeated seven times. The sintered bodies were then subjected to re-electrochemical formation at 17 V and 80° C. for 30 minutes in an aqueous 0.1% acetic acid solution, washed with water and dried.

[0088] Subseque...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
aging temperatureaaaaaaaaaa
widthaaaaaaaaaa
widthaaaaaaaaaa
Login to view more

Abstract

A method for producing a capacitor having a good capacitance appearance factor and a low ESR comprising, as one electrode (anode), an electric conductor having pores and having formed on the surface thereof a dielectric layer and, as the other electrode (cathode), a semiconductor layer formed on the electric conductor by energization in an electrolytic solution, the method comprising impregnating pores with a semiconductor layer-forming precursor before energization to render the concentration of semiconductor layer-forming precursor in pores higher than that of semiconductor layer-forming precursor in the electrolytic solution; a capacitor produced by the method; and an electronic circuit and an electronic device using the capacitor.

Description

CROSS REFERENCE TO THE RELATED APPLICATIONS [0001] This is an application filed pursuant to 35 U.S.C. Section 111(a) with claiming the benefit of U.S. Provisional application Ser. No. 60 / 513,590 filed Oct. 24, 2003 under the provision of 35 U.S.C. Section 111(b), pursuant to 35 U.S.C. Section 119(e)(1).TECHNICAL FIELD [0002] The present invention relates to a method for producing a capacitor having a good capacitance appearance factor and low ESR. BACKGROUND ART [0003] A capacitor used in a circuit associated with the central processing unit (CPU) in personal computers and the like is required to have high capacitance and low ESR (equivalent series resistance) in order to prevent the fluctuation of voltage and reduce the generation of heat at the passing of a high ripple current. In general, an aluminum or tantalum solid electrolytic capacitor is used. [0004] The solid electrolytic capacitor is constituted by an aluminum foil having fine pores in the surface layer or a tantalum powd...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/00H01L29/00H01G9/00H01G9/025H01G9/028H01G9/042
CPCH01G9/0036H01G9/028H01G9/042H01G9/0425Y10T29/417H01G11/48H01G11/56Y02E60/13H01G9/15H01G9/022
Inventor NAITO, KAZUMITAMURA, KATUTOSHI
Owner RESONAC CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products