8 results about "Electronic modules" patented technology

An electronic module (100) includes an elongated housing (10) having a front portion and a rear portion, with a pair of spaced guide members (123) integrated with a peripheral portion of the rear portion; a latch mechanism (60) assembled to the housing, said latch mechanism including a slider member (61) disposed between and supported by the pair of guide members, a bail member (62) pivotally engaging with the rear portion of the housing and further linking with the slider member; and rocking the bail actuating the slider moving along a front-to-back direction for detaching the electronic module from a receptacle module.

A multi-chip electronic module comprises a multiplicity of integrated circuit chips arranged in a vertical stack. Each chip includes at least one first electrical terminal, with at least a first subset of the first terminals being disposed at different heights relative to the stack. A multiplicity of second electrical terminals is disposed on a support member, and a multiplicity of first electrical conductors (e.g., wirebonds) is connected between the first subset and at least a second subset of the second terminals. In order to reduce the skew produced at relatively high frequencies, all of the first conductors have substantially the same inductive impedance at the frequency of operation of the module. Our invention is particularly well suited to modules that operate at frequencies of about 500 MHz or higher.

It is proposed a two-phase heat exchanger device for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate configured for being in contact with a first semiconductor module at a first side of the base plate; and at least one tube element for a first cooling medium including a first portion having at least one evaporator channel and a second portion having at least one condenser channel. The base plate has a groove containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.

The present invention is a packaged electronic module with embedded electronics for use in smart cards. This invention assembles a plurality of electronics components on a flexible printed circuit, together with an integrated circuit chip and a contact plate, into a module. This module can then be embedded into a plastic card, using regular milling techniques, by a card manufacturer. This method packages the plurality of electronics components into a module. The present invention provides a business with the capability to avoid additional capital expenditure required for special equipment and enables all existing card manufacturers to manufacture smart cards with embedded electronics.

An electronic module is provided, which comprises a first carrier; an electronic chip comprising at least one electronic component and arranged on the first carrier; a spacing element comprising a surface arranged on the electronic chip and being in thermal conductive connection with the at least one electronic component; a second carrier arranged on the spacing element; and a mold compound enclosing the electronic chip and the spacing element at least partially; wherein the spacing element comprises a material having a CTE value being matched with at least one other CTE.

The invention relates to a portable electronic device, which belongs to the electronic field. The portable electronic device mainly comprises an electronic module, and a filling compound slidably arranged on the electronic module. At least one electronic module metal conductor group is arranged at one side of the electronic module, and comprises a first metal conductor group, a second metal conductor group, a third metal conductor group and a fourth metal conductor group. The filling compound is provided thereon with a fifth metal conductor group, a sixth metal conductor group, a seventh metal conductor group and an eighth metal conductor group corresponding to and matched with the first, second, third and fourth metal conductor groups. Therefore, when the filling compound horizontally slides on the electronic module, the first, second, third and fourth metal conductor groups form mutual friction with the fifth, sixth, seventh and eighth metal conductor groups to thereby conduct, namely, the metal conductor groups will not be oxidized through friction, and the metal conductor groups are electrically conducted without welding by adopting slidable assembly technique, so as to prevent generation of unqualified products.