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8 results about "High surface" patented technology

Packaging method of SMD type LED with lens

InactiveCN102368514AIncrease productionGood consistencySemiconductor devicesAdhesiveHigh surface
The invention relates to a packaging method of an SMD type LED with a lens. Slice arrangement is directly carried out an electroplated SMD type LED patch support; adhesive dispersing is carried out on a die bonder to fix a chip; a fixed chip support box is placed in an oven and a crystal bonding adhesive is baked, so that the fixed chip support box is solidified; and then the solidified chip support box is placed in a welding wire machine and a gold wire or an alloy wire are employed to enable a P / N junction of the chip to be bonded with the support; and the bonded support is directly discharged into a moulding die with a lens and a press machine is utilized to inject a silicon resin or a silica gel into the moulding die, so that one-time injection moulding of an SMD type LED with a lens is completed. According to the packaging method of the SMD type LED with a lens in the invention, an injection method is utilized to produce the SMD type LED with a lens; and the output is high and the consistency is high; besides, the LED has high surface smooth finish and is free of air bubbles; a bonding force between materials is good; and injection and moulding can be completed once.
Owner:HUBEI KUANGTONG ELECTRONICS

Cutter system for super-speed cutting of numerically-controlled machine tool

ActiveCN107020535AHigh cutting speedImprove machining accuracyDriving apparatusNumerical controlAviation
The invention discloses a cutter system for super-speed cutting of a numerically-controlled machine tool. The system comprises a main shaft, a housing, a locking sleeve and a cutter. The system is characterized in that the upper end of the main shaft is connected with the numerically-controlled machine tool; an input bearing is mounted at the lower end of the main shaft and positioned on the housing; the main shaft is connected with a rotating frame, and a crankshaft is mounted on the rotating frame; an epicycloidal wheel and a cycloidal wheel bearing are mounted in the middle part of the crankshaft, and a planet gear which is engaged with a sun gear is mounted at the lower end of the crankshaft; an output bearing is mounted on the sun gear and positioned on the housing; the sun gear is connected with the upper end of the locking sleeve, and the lower end of the locking sleeve is connected with the cutter. The system has the beneficial effects that the cutting rotation speed is extremely high during the processing of aviation and precision optical devices; the processing effect is good; the processing accuracy is high; extremely high surface roughness can be obtained; the actual engineering requirement of high-speed cutting can be met; the technological gaps can be filled; and moreover, the social benefit and the economic benefit are high.
Owner:TIANJIN POLYTECHNIC UNIV

Method for preparing nanometer copper powder by recycling copper from etching liquid

ActiveCN112626567AWide variety of sourcesLow priceNanotechnologyGalvanic depositionHigh surface
The invention discloses a method for preparing nanometer copper powder by recycling copper from etching liquid. The method is characterized by comprising the following steps of: step 1. extracting waste etching liquid; step 2. carrying out back extraction; step 3. preparing microemulsion; step 4. carrying out electro-deposition; step 5. collecting the nanometer copper powder; and step 6. drying and packaging. The invention also provides the nanometer copper powder prepared by the method. According to the method for preparing the nanometer copper powder by recycling the copper from the etching liquid, raw materials are wide in source and low in price, the process is short, and the equipment investment is low; and the product has the advantages of controllable morphology and particle size, high purity, high surface activity, a large specific surface area and good dispersity, and is suitable for continuous large-scale production.
Owner:江苏净源新材料有限公司

Ultra-high molecular weight polyethylene bulletproof insertion plate of function laminated structure

PendingCN108106499ALight weightLow costArmour platesFiberResin matrix
An ultra-high molecular weight polyethylene bulletproof insertion plate of a function laminated structure comprises the following four layers of structures, and the four layers of structures sequentially comprise an outer protective layer, a bullet-resisting deceleration layer, an energy absorbing layer and a deformation restraining layer from outside to inside. The outer protective layer is madeof a waterproof sun-proof material and used for protecting the inner bullet-proof insertion plate structure. The bullet-resisting deceleration layer is made of high-surface-density nonwoven cloth anda thermosetting resin matrix through the mold pressing technology. The thermosetting resin matrix is manufactured through three-dimensional grid hot-pressing technology and forms a three-dimensional grid structure. The energy absorbing layer is made of low-surface-density nonwoven cloth and thermosetting resin matrix through the mold pressing technology. The deformation resisting layer is made ofhigh-surface-density nonwoven cloth and a thermosetting resin matrix through the mold pressing technology. On the premise of the same bulletproof effect, the ultra-high molecular weight polyethylene bulletproof insertion plate of the function laminated structure utilizes less bulletproof fiber, and the obtained insertion plate is lighter, low in manufacturing cost and excellent in protective performance.
Owner:河北普凡防护科技有限公司 +1
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