The invention discloses a method for forming a
semiconductor device with a contact
etching stop layer, which comprises the following steps of: providing a substrate on which at least one grid structure is formed; putting the substrate in a
settling chamber to carry out the settlement of the contact
etching stop layer; oxidizing the contact
etching stop layer in situ to form an
oxide film on the surface of the contact etching stop layer; taking out the substrate on which the
oxide film is formed; and forming an interlayer
dielectric layer on the
oxide film by high-density
plasma chemical
vapour deposition equipment. The invention also discloses the
semiconductor device with the contact etching stop layer. The
semiconductor device with the contact etching stop layer and the forming method thereof of the invention can effectively prevent damages which are caused by using the high-density and large-power
plasma in the step of
settling the interlayer
dielectric layer to a
gate oxide layer and voids phenomena of device performance drift, device reliability reduction and the like.