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7 results about "Vapour deposition" patented technology

Physical vapour deposition. Physical vapour deposition (PVD) is a process used to produce a metal vapour that can be deposited on electrically conductive materials as a thin, highly adhered pure metal or alloy coating. The process is carried out in a vacuum chamber at high vacuum (10–6 torr) using a cathodic arc source.

Semiconductor device with contact etching stop layer and forming method thereof

InactiveCN101740498AAvoid phenomena such as poor reliabilityAvoid damageSemiconductor/solid-state device detailsSolid-state devicesHigh densityGate oxide
The invention discloses a method for forming a semiconductor device with a contact etching stop layer, which comprises the following steps of: providing a substrate on which at least one grid structure is formed; putting the substrate in a settling chamber to carry out the settlement of the contact etching stop layer; oxidizing the contact etching stop layer in situ to form an oxide film on the surface of the contact etching stop layer; taking out the substrate on which the oxide film is formed; and forming an interlayer dielectric layer on the oxide film by high-density plasma chemical vapour deposition equipment. The invention also discloses the semiconductor device with the contact etching stop layer. The semiconductor device with the contact etching stop layer and the forming method thereof of the invention can effectively prevent damages which are caused by using the high-density and large-power plasma in the step of settling the interlayer dielectric layer to a gate oxide layer and voids phenomena of device performance drift, device reliability reduction and the like.
Owner:SEMICON MFG INT (BEIJING) CORP

Method for preparing cubic boron nitride single crystal-film homogeneous P-N junction

InactiveCN101807519AReduce processing difficultyIncrease productivitySemiconductor/solid-state device manufacturingDiffusion methodsSynthesis methods
The invention relates to a method for preparing cubic boron nitride (cBN) single crystal-film homogeneous P-N junction, and belongs to a method for preparing semiconductor components. The method comprises the steps of: synthesizing a semiconducting cBN single crystal with semiconductor characteristic and preparing a doped cBN film, wherein the cBN film has the semiconductor characteristic opposite to that of the cBN single crystal; the semiconducting cBN single crystal with the semiconductor characteristic is synthesized by a high-pressure direct synthesis method or a high-pressure re-diffusion method; and the doped cBN film is prepared by taking the semiconducting cBN single crystal with the semiconductor characteristic as a substrate and doping and growing a cBN film with a semiconductor type opposite to a substrate type by a vacuum vapor deposition method. The vacuum vapor deposition method is a vacuum physical vapor deposition method or a vacuum chemical vapor deposition method. The method has the advantages of reduction in processing difficulties, improvement on production efficiency, yield and the like and great improvement compared with the conventional technology for preparing a cBN homogeneous P-N junction by high-pressure systemization and re-growth processes.
Owner:JILIN UNIV
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