Wafer processing method

a processing method and film technology, applied in the field of film processing methods, can solve the problems of degrading achieve the effect of preventing the problem, and suppressing the degradation of the quality of each device chip

Active Publication Date: 2020-09-10
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a method for processing wafers, which prevents the adhesive layer from sticking to the back or front side of each device chip, resulting in better quality chips. This is achieved by using a polyolefin sheet without an adhesive layer, which prevents the adhesive layer from causing degradation. The method also eliminates the need for an adhesive tape with an adhesive layer.

Problems solved by technology

As a result, the quality of each device chip is degraded.

Method used

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Examples

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Embodiment Construction

[0032]A preferred embodiment of the present invention will now be described with reference to the attached drawings. There will first be described a wafer to be processed by a wafer processing method according to this preferred embodiment. FIG. 1A is a schematic perspective view of the front side of a wafer 1. FIG. 1B is a schematic perspective view of the back side of the wafer. The wafer 1 is a substantially disc-shaped substrate formed of a material such as silicon (Si), silicon carbide (SiC), gallium nitride (GaN), and gallium arsenide (GaAs). The wafer 1 may be formed of any other semiconductor materials. Further, the wafer 1 may be formed of a material such as sapphire, glass, and quartz. Examples of the glass include alkaline glass, nonalkaline glass, soda lime glass, lead glass, borosilicate glass, and silica glass. The wafer 1 has a front side 1a and a back side 1b. A plurality of crossing division lines 3 are formed on the front side 1a of the wafer 1 to thereby define a p...

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Abstract

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side or a front side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of applying a laser beam to the wafer to form modified layers in the wafer, thereby dividing the wafer into individual device chips, and a pickup step of picking up each device chip from the polyolefin sheet.

Description

BACKGROUND OF THE INVENTIONField of the Invention[0001]The present invention relates to a wafer processing method for dividing a wafer along a plurality of division lines to obtain a plurality of individual device chips, the division lines being formed on the front side of the wafer to thereby define a plurality of separate regions where a plurality of devices are individually formed.Description of the Related Art[0002]In a fabrication process for device chips to be used in electronic equipment such as mobile phones and personal computers, a plurality of crossing division lines (streets) are first set on the front side of a wafer formed of a semiconductor, for example, thereby defining a plurality of separate regions on the front side of the wafer. In each separate region, a device such as an integrated circuit (IC), a large-scale integrated circuit (LSI), and a light emitting diode (LED) is next formed. Thereafter, a ring frame having an inside opening is prepared, in which an adhe...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/78B23K26/364B23K26/40C09J7/24H01L21/304H01L21/683
CPCH01L21/78H01L21/6836H01L2221/68327H01L2221/6834C09J7/241B23K26/364H01L21/3043B23K26/40H01L21/6835H01L2221/68336H01L2221/68381H01L2221/68322H01L21/67132H01L21/67115C08L23/06C08L23/12B23K26/53
Inventor HARADA, SHIGENORIMATSUZAWA, MINORUKIUCHI, HAYATOYODO, YOSHIAKIARAKAWA, TAROAGARI, MASAMITSUKAWAMURA, EMIKOFUJII, YUSUKEMIYAI, TOSHIKIOHMAE, MAKIKO
Owner DISCO CORP
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