13 results about "Conductive polymer" patented technology

The present invention is directed to a reversibly adhesive thermal interface material for electronic components and methods of making and using the same. More particularly, embodiments of the invention provide thermal interface materials that include a thermally-reversible adhesive, and a thermally conductive and electrically non-conductive filler, where the thermal interface material is characterized by a thermal conductivity of 0.2 W/m-K or more and an electrical resistivity of 9×10¹¹ ohm-cm or more.

The invention relates to a flexible physiological dry electrode and a preparation method of the flexible physiological dry electrode. The flexible physiological dry electrode comprises a conductive poly-dimethyl siloxane electrode and a connection buckle; the conductive poly-dimethyl siloxane electrode is used for contacting the skin; the connection buckle is used for leading out a lead to a measurement circuit, and the connection buckle is partially embedded inside the conductive poly-dimethyl siloxane electrode. The conductive poly-dimethyl siloxane electrode has the advantages of being high in collecting quality, strong in reliability, safe and comfortable, low in cost and wide in application range.

The present invention relates to a new process of synthesizing conductive polymers from monomers substituted with amine group. The process provides simple synthesizing steps for the conductive polymers without using other additives such as stabilizers or emulsifiers. The conductive polymers synthesized according to the present invention have highly enhanced solubility in common organic solvents and electrical conductivity compared to conventional conductive polymers. Therefore, the conductive polymers synthesized according to the present process can be utilized in applications that require high electrical conductivity, for example an electromagnetic interference shield or a transparent electrode of thin film, as well as in specific applications such as various conductive films, fibers, polymer blends, battery electrodes or conductive etch mask layers.

The invention discloses a conductive plastic for processing a power supply cover plate, and a fabrication method of the power supply cover plate. The conductive plastic comprises the following raw materials by weight percentage: 50-60% of high-polymer base material, 15-25% of conductive filler, 15-20% of fire retardant and 1-5% of flexibilizer. According to the conductive plastic for processing the power supply cover plate, and the fabrication method of the power supply cover plate, the fabricated power supply cover plate is 40-50% lighter than the traditional aluminum cover plate; the acid-base corrosiveness resistance is high; the resistivity is adjustable; the shielding effectiveness of various frequency bands can be adjusted by changing an additive amount of the conductive filler; forming is convenient; secondary processing is not required; and compared with the aluminum cover plate, the total cost is lowered remarkably.

An electrically conductive composition and a fabrication method thereof are provided. The electrically conductive structure includes a major conductive material and an electrically conductive filler of an energy delivery character dispersed around the major conductive material. The method includes mixing a major conductive material with an electrically conductive filler of an energy delivery character to form a mixture, coating the mixture on a substrate, applying a second energy source to the mixture while simultaneously applying a first energy source for sintering the major conductive material to form an electrically conductive composition with a resistivity smaller than 10×10⁻³Ω·cm.

The invention discloses a polypyrrole coated Ni-Co-S nanoneedle array composite material. Nickel acetate, cobalt acetate, urea and thiourea are used as raw materials for preparing an NF/NiCo2S4 nanoneedle array material; polypyrrole is used as a conductive polymer for preparing the polypyrrole coated Ni-Co-S nanoneedle array composite material through an adhesive and a curing agent, wherein the nanoneedle structure has a shell-core structure, the core structure is NiCo2S4, and the shell structure is polypyrrole. A preparation method of the NF/NiCo2O4 nanoneedle array material comprises the following steps: 1) preparing the NF/NiCo2O4 nanoneedle array material; (2) preparing the NF/NiCo2S4 nanoneedle array material; (3) preparing the polypyrrole coated Ni-Co-S nanoneedle array composite material. When the material is applied as a supercapacitor electrode material, the window voltage is 0-0.5 V, and the specific capacitance is 1,800-1,900 F/g when the discharge current density is 1A/g. The nanoneedle array grown on the surface of the foamed nickel carrier is regular and ordered in structure and large in specific surface area, so the electron transmission is facilitated; the coating of the conductive polymer is realized by adopting a direct dripping method, so the electrochemical performance is effectively improved.

The invention relates to a method for preparing the conductive filler of antistatic materials. The method belongs to the technical field of conductive filler. The method aims at the existing problems including the loss of antistatic performance during the long-term use of antistatic conductive fillers, the large additive amount of carbon black, the low dispersity and the poor mechanical properties of carbon black in substrate, and the poor adjustability. To prepare the conductive filler of antistatic materials with high antistatic performance, at first, the method utilizes the natural conductive antistatic materials contained in sugarcane roots and soybean sprouts to cultivate microorganism through stewing and crude extracting, and blending with nutriment; during the cultivation period, the antistatic performance of the microorganism is improved by using electricity as the induction to promote the variation of the microorganism; then, the microorganism is used to modify the carbon black to improve the dispersity and the mechanical properties of the carbon black, while the conductivity of the carbon black is further improved by loading silver ions on the surface of the carbon black.

The invention provides a pyrrole and 3,4-ethylenedioxythiophene copolymerization nanowire array, also discloses a preparation method thereof, and relates to a plurality of technical fields of macromolecule copolymerization, a nanowire array, a conductive polymer material, and a macromolecule capacitor and the like. The highest current density, the discharging time, the specific capacity and the capacity retention rate of the PPE nanowire array prepared by the method are obviously higher than the current density of pyrrole and 3,4-ethylenedioxythiophene homopolymer; and poly 3,4-ethylenedioxythiophene and polypyrrole are different a lot, the electrical property of the poly 3,4-ethylenedioxythiophene is much weaker than that of the polypyrrole, meanwhile, the size of the poly 3,4-ethylenedioxythiophene is relatively large, and two annular radical groups will be perpendicular to the nanowire array and are distributed around the nanowire array during polymerization.

Thermally developable materials that comprise a support have an antistatic backside layer that includes a quaternary ammonium salt. The same or different backside layer can also include another antistatic agent such as conductive metal particles or conductive polymers. These thermally developable materials include both thermographic and photothermographic materials that can be suitably imaged to provide images useful for medical diagnoses.

An electronic device has three conductive polymer layers sandwiched between two external electrodes and two internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal. The device is manufactured by: (1) providing (a) a first laminated substructure comprising a first polymer layer between first and second metal layers, (b) a second polymer layer, and (c) a second laminated substructure comprising a third polymer layer between third and fourth metal layers; (2) isolating selected areas of the second and third metal layers to form, respectively, first and second arrays of internal metal strips; (3) laminating the first and second laminated substructures to opposite surfaces of the second conductive polymer layer to form a laminated structure; (4) isolating selected areas of the first and fourth metal layers to form, respectively, first and second arrays of external metal strips; (5) forming insulation areas on the exterior surfaces of the external metal strips; and (6) forming a plurality of first terminals, each electrically connecting a metal strip in the first internal array to a metal strip in the second external array, and a plurality of second terminals, each electrically connecting a metal strip in the first external array to a metal strip in the second internal array; and (7) singulating the laminated structure into a plurality of devices, each having three polymer layers connected in parallel between first and second terminals.