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46results about "Single crystal growth details" patented technology

Technique for perfecting the active regions of wide bandgap semiconductor nitride devices

InactiveUS20050164475A1Lower average currentHigh densityPolycrystalline material growthFrom solid stateEngineeringNitride
This invention pertains to e lectronic / optoelectronic devices with reduced extended defects and to a method for making it. The method includes the steps of depositing a dielectric thin film mask material on a semiconductor substrate surface; patterning the mask material to form openings therein extending to the substrate surface; growing active material in the openings; removing the mask material to form the device with reduced extended defect density; and depositing electrical contacts on the device.
Owner:THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY

Method and apparatus for preparing major diameter single crystal

InactiveCN1847468AMake up for heat lossHigh Inductive Heat InputPolycrystalline material growthBy zone-melting liquidsSingle crystalEngineering
The present invention relates to an apparatus and method for growing a high melting point single crystal having a predetermined orientation, which is grown from a culture rod (3) by a floating zone method or a suspension zone method. The device comprises: culture rods (3) and crystal nuclei (4), a strip-shaped resistance heating type heating strip (6) provided with at least one opening is installed between its ends and next to it, and it is heated To the crystal melting temperature, so as to form the melting zone (5), drive mechanism (8, 11), so that relative movement occurs between the heating belt (6) and the crystal nucleus (4) and the culture rod (3) that are installed next to the heating belt , the molten liquid material of the culture rod (3) is obtained through each opening of the heating belt, and causes single crystal growth on the crystal nucleus (4) by cooling, and another heating device (15, 16), which is arranged at the melting The vicinity of the zone (5) in order to set the temperature gradient within the range of the melting zone (5). In order to reduce the temperature gradient in the melting zone, said further heating device (15, 16) comprises at least one heating coil (17, 19), which is driven with radio frequency, wherein the heating strip (6) and the respective heating coil are thus mounted opposite each other (17, 19) so that radio frequency radiation is coupled on the heating strip in order to generate an additional inductive heat input in the heating strip and to set a temperature gradient across the melting zone (5). This enables an inductive heat input into the heating strip, which can be varied or varied in a targeted manner.
Owner:SCHOTT AG

Novel single-crystal furnace for zinc cadmium telluride single crystal and growth process

PendingCN107059132AAchieve growthImprove the growing environmentPolycrystalline material growthFrom frozen solutionsTemperature controlCrucible
The invention discloses a novel single-crystal furnace for a zinc cadmium telluride single crystal and a growth process. A furnace body and a heating power supply are provided; a quartz tube is arranged in the hearth; a crucible is arranged in the quartz tube; a seed crystal cavity is form on a lower part in the crucible; a support frame is arranged below the quartz tube; sealing plugs are arranged at an upper end and a lower end of the hearth; nine heating areas are arranged in the hearth of the furnace body from top to bottom in sequence; each heating area is provided with an electrode which communicates with a power supply cabinet, a cable and a self-control switch; a temperature control system is provided further. The novel single-crystal furnace has the advantages of suitability for growth of the zinc cadmium telluride single crystal, omission of mechanical movement, formation of a no-vibration growth environment, realization of segmental flexible control of the growth temperature, great reduction in time for heating and smelting materials and receiving the seed crystal, and improvement on the quality and production efficiency of the single crystal. Moreover, the novel single-crystal furnace has the advantages of compact entire structure, small floor area, lower equipment cost, easiness in mounting, programmed control, accurate running, and stable repeatability. By adopting the novel single-crystal furnace, a large-diameter zinc cadmium telluride single crystal can be generated rapidly.
Owner:磐石创新(江苏)电子装备有限公司

Seeding mold for growing silicon crystals by using orientated solidification method and crystal growing method

InactiveCN102146580AFix placement issuesEliminate dislocationsPolycrystalline material growthFrom frozen solutionsSpontaneous nucleationDislocation
The invention discloses a seeding mold for growing silicon crystals by using an orientated solidification method and a crystal growing method. The seeding mold is arranged at the internal bottom of a quartz crucible and comprises a seed crystal container and a sealing liquid container, wherein the sealing liquid container consists of cavities connected to the periphery of the seed crystal container and is used for accommodating a sealing substance; and the seed crystal container is provided with a first cavity for accommodating seed crystals. A method for growing monocrystalline silicon/similar monocrystalline silicon by adopting the seeding mold comprises the following steps of: arranging or setting the seeding mold at the bottom of the quartz crucible; arranging the sealing substance and the seed crystals in the sealing liquid container and the seed crystal container respectively; putting a silicon raw material into the quartz crucible; and growing monocrystals/similar monocrystals by adopting orientated solidification. By adopting the seeding mold and the crystal growing method, the problem of placement of the seed crystals can be solved without changing the structures of the conventional orientated solidification and quartz crucible, dislocation of the seed crystals in the seeding process is eliminated, and the spontaneous nucleation phenomenon of melt from the bottom wallface of the crucible is avoided. The seeding mold has low cost and is easy to process.
Owner:GREENERGY CRYSTAL TECH

Nanostructuring process for ingot surface, wafer manufacturing method, and wafer using the same

InactiveUS20120193764A1Improve surface strengthReduce generationMaterial nanotechnologyPolycrystalline material growthWaferingMetallurgy
The instant disclosure relates to a nanostructuring process for an ingot surface prior to the slicing operation. A surface treatment step is performed for at least one surface of the ingot in forming a nanostructure layer thereon. The nanostructure layer is capable of enhancing the mechanical strength of the ingot surface to reduce the chipping ratio of the wafer during slicing.
Owner:SINO AMERICAN SILICON PROD

Method for preparing polysilicon

InactiveCN1727525AReduce the temperatureLower threshold voltagePolycrystalline material growthSemiconductor/solid-state device manufacturingFine lineSemiconductor materials
A process for preparing polycrystal silicon includes preparing non-crystal silicon film on glass substrate, preparing a thin Ni layer, photoetching the Ni layer to become fine lines, laser annealing, removing excessive Ni, and laser annealing again for crystallizing the silicon film. Its advantages are short time and low substrate temp.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI

Manufacturing method of semiconductor device

InactiveCN102468153AEfficient reorganizationIncrease etch ratePolycrystalline material growthAfter-treatment detailsPulsed laser beamCrystalline silicon
In a manufacturing method of a semiconductor device, a substrate including single crystalline silicon is prepared, a reformed layer that continuously extends is formed in the substrate, and the reformed layer is removed by etching. The forming the reformed layer includes polycrystallizing a portion of the single crystalline silicon by irradiating the substrate with a pulsed laser beam while moving a focal point of the laser beam in the substrate.
Owner:DENSO CORP

Mounting plate assembly for monocrystalline silicon growth furnace

ActiveCN104213190AConvenient and safe crystal extractionShorten the timePolycrystalline material growthBy pulling from meltEngineeringCooling time
The invention relates to the field of monocrystalline silicon growth furnaces and aims at providing a mounting plate assembly for a monocrystalline silicon growth furnace. The mounting plate assembly for the monocrystalline silicon growth furnace comprises a connector bolt, a mounting plate and switch assemblies, wherein the switch assemblies comprise a switch assembly A and a switch assembly B; the switch assembly A is used for controlling a secondary furnace chamber and a furnace lid of the monocrystalline silicon growth furnace to move or not; the switch assembly B is used for controlling the secondary furnace chamber to move independently or move together with the furnace lid; by matching of the connector bolt and the mounting plate, the secondary furnace chamber and the furnace lid of the monocrystalline silicon growth furnace can be connected or disconnected. The mounting plate assembly can be used for conveniently and safely taking monocrystalline silicon at any time in the middle, the monocrystalline silicon can be taken out without waiting for the monocrystalline silicon is slowly cooled in the furnace body, and thus, the material cooling time and the residual material reheating time can be saved, the production cost can be lowered, and the production efficiency can be improved.
Owner:ZHEJIANG JINGSHENG MECHANICAL & ELECTRICAL

Single crystal pulling device, preparation method of single crystal silicon and single crystal silicon

InactiveCN109554756APrevent inflowReduce dislocationPolycrystalline material growthUnder a protective fluidSingle crystalEngineering
Embodiments of the present invention provide a single crystal pulling device, a preparation method of single crystal silicon, and the single crystal silicon. The single crystal pulling device includesa housing, a melting member and a blocking member; the housing is provided with a receiving space, the receiving space includes at least a first chamber and a second chamber communicating with the first chamber, and the second chamber is located above the first chamber; the melting member is used for heating and melting polysilicon, and the melting member is fixed to the bottom of the first chamber; and the blocking member is located in the second chamber, and the blocking member is used for injecting an inert gas in a preset manner to prevent impurities generated by the polysilicon melting process from entering the upper chamber of the second chamber. With the single crystal pulling device disclosed by the embodiments of the invention, a large amount of impurities can be prevented from flowing into the upper chamber of the single crystal pulling device, thereby reducing the dislocation problem of a single crystal silicon rod caused by impurities, improving the crystal quality, and also facilitating the cleaning work of the receiving space.
Owner:XIAN ESWIN SILICON WAFER TECH CO LTD

Method for reducing content of carbon in single crystal bar

ActiveCN109097822APrevent fallingAvoid enteringPolycrystalline material growthBy pulling from meltLower limitCrucible
The invention discloses a method for reducing content of carbon in a single crystal bar. The method specifically comprises steps as follows: (1) a thermal field below a liquid level is mounted at thelower end of a furnace tube; (2) a material block is put in a crucible by means of a hoisting procedure, material protecting cloth is uniformly spread, wherein traction wires are uniformly arranged onone surface of the material protecting cloth, all the traction wires are connected together through a traction wire guide block, the traction wire guide block is arranged in the center of the material protecting cloth, the surface without traction wires completely covers the material blocks put in the crucible, and the crucible is descended to the lower limit position in the furnace tube and located at the upper end of the thermal field below the liquid level; (3) a thermal field above the liquid level is mounted, and the furnace tube is started to be closed after mounting; (4) after the furnace tube is closed, the traction wire guide block is lifted upwards, the material protecting cloth is directly taken out, and the furnace is continuously closed; (5) after the tube is closed, the material protecting cloth is turned over in the designated position of a workshop, so that lifted graphite powder and other impurities are lifted, then, the material protecting cloth is blown clean on thewhole with a blower, and the material protecting cloth and a sucker are transported to a charging chamber.
Owner:BAOTOU MEIKE SILICON ENERGY CO LTD

Preparation method of silicon carbide microcrystalline homogenized in dimension and shaped in polyhedron form

ActiveCN103643294AUniform nucleationUniform growth orientationPolycrystalline material growthFrom frozen solutionsCrucibleCrystal growth
The invention related to a preparation method of a silicon carbide microcrystalline homogenized in dimension and shaped in a polyhedron form. The preparation method comprises the following steps of: putting the SiC raw material in a crucible, fastening a microcrystalline depositing collector at the inner side of a crucible cover, screwing the crucible and then putting the crucible in a crystal growth furnace; vacuumizing the crystal growth system until the vacuum degree is less than 5*10<-3>Pa, and then filling an atmosphere gas of 1-20000Pa; increasing the temperature of the crystal growth system so that the temperature of the raw material zone is in the range from 1800 to 2200 DEG C, keeping the temperature of the microcrystalline depositing collector at the crucible cover in the range from 1750 to 2100 DEG C, and starting microcrystalline growing; and after the microcrystalline grows for 0.5-2 hours, turning off the power of the crystal growth furnace. The preparation method provided by the invention is not involved with any other precursor and catalyst; besides, the raw material zone is separated from the deposition growth zone; the obtained SiC microcrystalline dimension is adjustable in the range from 10 to 50 microns; the microcrystalline obtained is separated from each other and shaped in the polyhedron form; the microcrystalline growth period is short, and the microcrystalline growth method is simple and easy to popularize; therefore, the preparation method of the silicon carbide microcrystalline homogenized in dimension and shaped in the polyhedron form is suitable for large-scale industrial production and has high practicable value.
Owner:HEBEI SYNLIGHT CRYSTAL CO LTD

Preparation method of lithium niobate single crystal

ActiveCN105839178AHigh purityUniform compositionPolycrystalline material growthBy pulling from meltMass ratioLithium carbonate
The invention relates to a preparation method of lithium niobate single crystal. The method comprises the following steps: (a) mixing niobium oxides and lithium carbonate according to the mass ratio of 79.1-79.2:20.8-20.9, and pressing the mixture to be blocky mixture after adding water; (b) adding the blocky mixture into a first heating furnace, heating the heating furnace from the room temperature to 1150 DEG C at the speed of 8-10 DEG C/min, and maintaining the temperature for 1.5-2 hours to obtain the initial product; and (c) adding the initial product into a crucible placing in a second heating furnace, adjusting the seed crystal rod to make the seed rod be concentric with the crucible, heating the initial product to melt the initial product, cooling the product to 1330-1350 DEG C, adjusting the rotating speed of the seed crystal rod to 8-15 rpm, declining the seed crystal in the lower end of the seed crystal rod to the meltwater to inoculate the crystal, and lifting upward the product at the speed of 4-6 mm/h to perform growth when the diameter of the seed crystal is expanded to 20-30 mm. The near-stoichiometric lithium niobate crystal with high purity and uniform component can be prepared by means of controlling accurately the conditions such as raw material proportion, technology step, and heating mode.
Owner:YANCHENG GENION ELECTRONICS MATERIALS FACTORY

Method for improving epitaxial growth rate of silicon

A method for improving the epitaxial growth rate of silicon comprises the following steps: heating a reaction cavity base; introducing gaseous trichlorosilane carried by hydrogen as a growth raw material; removing reaction byproducts by using hydrogen; mounting a silicon substrate slice on the reaction cavity base, and heating the base; removing various impurities volatilized from the silicon substrate slice and the base by using hydrogen; taking gaseous trichlorosilane carried by hydrogen as a growth raw material, and growing a silicon epitaxial layer on the surface of the silicon substrate slice; removing the reaction byproducts in the growth process out of the reaction cavity by using hydrogen; and taking out after the temperature of the silicon epitaxial wafer is reached. The production efficiency of the silicon epitaxial wafer with the thickness of 150-200 mm is greatly improved, the process time and the maintenance cost are remarkably reduced, the process is simple, the operability is high, and the method is a large-scale industrial production technology suitable for the extremely-thick silicon epitaxial wafer with the silicon epitaxial layer thickness higher than 150 [mu]m and can be applied to the field of high-voltage power devices.
Owner:CHINA ELECTRONICS TECH GRP NO 46 RES INST +1

Graphite disc turnover type GaN single crystal substrate laser pre-stripping integrated cavity

PendingCN111778559AAchieve heat preservationReduced growth quality issuesPolycrystalline material growthFrom chemically reactive gasesSingle crystal substrateSingle crystal
The invention discloses a graphite disc turnover type GaN single crystal substrate laser pre-stripping integrated cavity. A heat preservation tray containing a phase change material is adopted to achieve heat preservation of a graphite disc, the temperature of the heat preservation tray can be kept at 700 DEG C or above within a certain period of time, the probability of growth quality problems caused by sudden temperature change or too low temperature of a GaN single crystal substrate slice is remarkably reduced, and the growth quality of GaN single crystals is improved; the integrated chamber is connected with the HVPE equipment, a certain vacuum degree or inert gas filling can be achieved in the chamber, the heating and heat preservation functions are achieved, the environment atmosphere of the GaN single crystal substrate slice in the whole transfer process can be guaranteed, and the growth quality of the GaN single crystal substrate in the subsequent process is guaranteed; the transfer tray with the heat preservation function is adopted to transfer the GaN single crystal substrate slices in the heat preservation tray in the integrated cavity in a full-disc mode, the sapphire substrate faces of all the GaN single crystal wafers face upwards, and therefore the Bernoulli adsorption transmission mode can be canceled, and the laser pre-stripping efficiency of the GaN single crystal substrate slices can be remarkably improved.
Owner:GENERAL ENG RES INST CHINA ACAD OF ENG PHYSICS
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